Thermal Head Spacer Design for Uniform Temperature
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Solution Overview
Problem
Existing thermal printers suffer from density unevenness in recorded images due to temperature non-uniformity in the thermal head substrate, which complicates the design and increases costs with the need for memory and correction circuits.
Innovation Solution
A thermal printer design featuring spacers, such as pins, that create gaps between the support plates and the head substrate, maintaining uniform temperature across the thermal head by allowing heat transfer through these spacers, thereby preventing density unevenness and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If printing data is corrected based on virtual data that estimates heat quantity at the both ends of the thermal head, then density unevenness in the recorded image is prevented, but the printer becomes complicated and cost increases
Solution Approach 1:
A heat insulating plate is introduced as an intermediary component between the thermal head and the support structure. This plate prevents excessive heat transfer to the both ends of the thermal head, thereby maintaining uniform temperature distribution without requiring complex correction circuits or memory systems. The heat insulating plate acts as a passive thermal mediator that automatically compensates for the temperature non-uniformity issue.
2Temperature
If heat is transferred to the support plate contacting with the both ends of the head substrate, then the temperature of the both ends of the thermal head becomes lower than the central portion, but this causes density unevenness in the recorded image
Solution Approach 1:
The heat insulating plate serves as a thermal intermediary that blocks excessive heat flow from the thermal head to the support plate. By positioning this insulating plate at the both ends of the thermal head, the system prevents the cooling effect that would otherwise occur at these locations, thereby maintaining uniform temperature distribution across the entire thermal head and ensuring consistent image density.
Solution Approach 2:
The support plate, which initially causes harmful heat loss at the thermal head ends, is redesigned to include heat insulating portions. This converts the harmful heat transfer pathway into a beneficial thermal insulation structure, preventing the temperature drop at the ends while maintaining the structural support function of the plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents density unevenness in the recorded images by maintaining uniform temperature across the thermal head substrate, reducing the need for complex correction circuits and memory, and lowering costs.
Implementation Method 1
Heat energy generated from the heating element is partially transferred to the head substrate. The heat is further transferred to the support plate contacting with the both ends of the head substrate.
Implementation Method 2
spacers for creating gaps between the support plates and the both ends
Data Source
AI summary
In a thermal head, a heating element array is formed in a head substrate. Both ends of the head substrate are attached to a pair of support plates by a bolt. Plural pins protruding toward the head substrate are provided in the support plate. A gap is formed between the head substrate and the support plate through the pins. The gap prevents heat of the both ends of the head substrate from transferring to the support plate, and contributes to uniform the temperature in the overall length of the head substrate.