Multi-Path Thermal Head Control for Rapid Device Temperature Cycling
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Solution Overview
Problem
Current methods for rapid thermal conditioning of electronic devices during testing are inefficient, as they either heat and cool the test head simultaneously, require energy-intensive air heating and cooling, or involve inefficient mixing of thermal transfer fluids, leading to prolonged testing times and increased costs.
Innovation Solution
An apparatus with a thermal head fluid path that receives thermal transfer fluid from a combined path and outputs it to a pump assembly, which controls the flow through heating and cooling assemblies via valves, allowing precise temperature regulation by adjusting the flow of thermal transfer fluid through separate paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If resistive heating is used to heat the test head, then the temperature of the test head can be raised rapidly, but the test head must also be cooled simultaneously which reduces thermal efficiency
Solution Approach 1:
The thermal control system is segmented into separate heating and cooling paths. The heating path uses resistive heating elements while the cooling path uses a fluid cooling system with heat exchangers. This segmentation allows independent optimization of each path, enabling rapid temperature changes without the energy waste of simultaneous heating and cooling.
Solution Approach 2:
The patent combines multiple thermal control functions into an integrated system that can rapidly switch between heating and cooling modes. The merged system includes temperature sensors, control logic, and actuated components that work together to achieve rapid thermal conditioning by selecting the appropriate thermal path based on desired temperature changes.
2Speed
If air is heated and cooled to provide rapid thermal conditioning, then temperature control speed improves, but energy consumption increases significantly
Solution Approach 1:
The patent employs fluid-based thermal transfer systems instead of air heating/cooling. Liquid thermal transfer fluids are circulated through heat exchangers connected to the test head, providing efficient heat transfer with lower energy consumption compared to heating and cooling large volumes of air.
Solution Approach 2:
The system recovers thermal energy by using heat exchangers that can transfer heat from the thermal transfer fluid to cooling systems, rather than discarding the thermal energy through air cooling. This energy recovery approach reduces overall energy consumption while maintaining rapid thermal conditioning capability.
3Adaptability or versatility
If thermal transfer fluids are mixed to achieve intermediate temperatures, then temperature control flexibility improves, but the mixing process becomes inefficient
Solution Approach 1:
The patent uses a thermal transfer fluid as an intermediary carrier that absorbs and transports thermal energy between heat exchangers and the test head. By controlling the flow rate and temperature of this intermediary fluid, the system achieves versatile temperature control without inefficient mixing of hot and cold fluids.
Solution Approach 2:
The system achieves intermediate temperatures by changing parameters such as thermal transfer fluid flow rate, inlet temperature, and heat exchanger configuration, rather than by physically mixing hot and cold fluids. This parameter-based control maintains thermal efficiency while providing adaptability across a range of temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and efficient temperature control of electronic devices by minimizing heat capacity and maximizing thermal conductivity in the thermal head, reducing testing time and costs while maintaining thermal efficiency.
Implementation Method 1
heating of the stream of air is done by resistive heating thereof
Implementation Method 2
placing a fluid-cooled test head in contact with a DUT, where the temperature of the test head is modulated
Implementation Method 3
a thermal head fluid path adapted to be in thermal contact with the device
Data Source
AI summary
Apparatus to control device temperature includes a thermal head fluid path in thermal contact with the device, a pump assembly, a temperature sensor in communication with a controller, and first, second and third valves operable in response to the controller wherein the fluid path receives thermal transfer fluid from a combined path and outputs it to the pump assembly, the pump assembly outputs the fluid to a first, a second and a third path, all connected to the combined path wherein the first path is in thermal contact with a heat assembly and the second path is in thermal contact with a cooling assembly, the temperature sensor senses a temperature of the fluid path, and the first, second and third valves are disposed in the first, second and third paths to control fluid flow therethrough, respectively.