Thermal Head Independent Zone Control IC Testing
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Solution Overview
Problem
Existing test systems struggle to independently control the temperature and force of multiple components within close proximity during device testing, particularly in complex integrated circuit (IC) chips, due to differences in power dissipation and structural variations, leading to inadequate thermal management.
Innovation Solution
A thermal head system comprising multiple adapters, heaters, and thermal controllers that allow independent temperature and force control of each component, using heaters and cold plates to maintain specific set point temperatures and applying forces through mechanisms like pneumatic or hydraulic cylinders, enabling precise thermal and mechanical management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single thermal control system is used for multiple components, then device complexity is reduced, but temperature control precision for each component deteriorates
Solution Approach 1:
The thermal control system is divided into multiple independent thermal zones, each with its own heater and controller. This segmentation allows each component to be controlled independently while maintaining overall system manageability, resolving the contradiction between system complexity and control precision.
Solution Approach 2:
Each thermal zone is equipped with localized heating and control mechanisms tailored to the specific thermal requirements of individual components. This local quality approach enables precise temperature control for each component without requiring a completely separate system for each, balancing complexity and precision.
2Productivity
If components are placed in close proximity to increase integration density, then productivity is improved, but temperature control stability deteriorates due to thermal interference
Solution Approach 1:
The substrate is divided into multiple isolated thermal zones with individual control systems. This segmentation prevents thermal interference between closely spaced components, allowing high integration density while maintaining temperature stability for each component.
Solution Approach 2:
Thermal isolation structures act as intermediaries between adjacent components, preventing direct thermal coupling. This allows components to be placed in close proximity for high density while maintaining independent temperature control and stability.
3Manufacturing precision
If different thermal control parameters are applied to each component, then temperature control precision is improved, but device complexity increases
Solution Approach 1:
A standardized thermal control architecture is implemented across all zones, where each zone uses the same basic components (heater, sensor, controller). This universality allows different thermal parameters to be applied to each component while avoiding the complexity of completely custom systems, as the same building blocks are reused throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous and independent control of temperature and force across multiple components, ensuring accurate testing by maintaining precise thermal and mechanical conditions, even in complex IC chip structures with varying power dissipation and structural configurations.
Implementation Method 1
one or more heaters thermally coupled to the plurality of adapters and the one or more components of the one or more devices under test, wherein the one or more heaters are configured to heat the one or more components
Implementation Method 2
one or more cold plates thermally coupled to the plurality of adapters, wherein the one or more cold plates are configured to cool the plurality of adapters
Data Source
AI summary
Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.