Thermal Hinge Assembly With Integrated Heat Transfer and Rotation Durability
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Solution Overview
Problem
Existing electronic devices with heat pipes in hinge assemblies face issues of increased thickness and reduced durability due to deformation during housing rotation, affecting the slimness and rotation functionality of the device.
Innovation Solution
A thermal hinge assembly comprising a first and second hollow hinge member, a center hinge member, and a heat transfer member that penetrates through these components, along with rotation guides, to facilitate heat transfer and enhance rotation durability while minimizing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe is disposed in a hinge assembly to discharge heat, then heat transfer capability is improved, but the thickness of the hinge assembly increases
Solution Approach 1:
The patent merges the hinge assembly structure with the heat pipe structure by making the heat pipe penetrate through the hollow hinge members. The hinge members serve dual purposes: providing mechanical rotation functionality and serving as heat transfer pathways. This integration eliminates the need for separate heat dissipation components, thereby improving heat transfer capability without increasing hinge assembly thickness.
Solution Approach 2:
The hollow hinge members are designed to perform multiple functions simultaneously: (1) enabling rotational movement between housings, (2) serving as structural support elements, and (3) acting as heat transfer conduits for the heat pipe. This multi-functionality allows the hinge assembly to discharge heat effectively while maintaining a compact thickness.
2Temperature
If a heat pipe is disposed in a hinge assembly to discharge heat, then heat transfer capability is improved, but the thickness of the housing increases
Solution Approach 1:
The patent integrates the heat pipe directly into the hinge assembly structure, allowing the housing thickness to be determined by the hinge assembly thickness rather than requiring additional space for separate heat dissipation components. The heat pipe penetrates through the hollow hinge members, enabling heat discharge without increasing overall housing thickness.
3Temperature
If a heat pipe is disposed in a hinge assembly to discharge heat, then heat transfer capability is improved, but the durability of the hinge assembly for transferring heat is degraded
Solution Approach 1:
The patent employs rotation guide parts that enable dynamic adjustment of the heat pipe's position and orientation during housing rotation. The rotation guides allow the heat pipe to move flexibly with the hinge assembly, preventing stress concentration and deformation that would occur with a rigid fixed structure. This dynamic design maintains heat transfer capability while improving durability during rotational operations.
Solution Approach 2:
The rotation guide parts change the spatial parameters (position and orientation) of the heat pipe relative to the hinge members during rotation. By allowing these parameters to vary dynamically, the system accommodates rotational movement without causing deformation to the heat pipe, thereby maintaining both heat transfer capability and structural durability.
4Temperature
If a heat pipe penetrates between hinge components, then thermal resistance between hinge components is minimized, but device complexity increases
Solution Approach 1:
The patent combines the heat transfer function with the structural hinge components by having the heat pipe penetrate directly through the hollow hinge members. This integration creates direct thermal contact between components, minimizing thermal resistance. The unified structure of hinge members serving as both mechanical and thermal elements reduces the number of separate components, thereby managing device complexity while achieving low thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the thickness of housings and enhances rotation durability by providing efficient heat transfer paths and minimizing deformation, thus improving the overall performance and slimness of the electronic device.
Implementation Method 1
at least one heat transfer member disposed to penetrate through the first and second hollow hinge members and the center hinge member, and thermally coupled with the first and second hollow hinge members and the center hinge member
Data Source
AI summary
An electronic device is provided. The electronic device includes a first housing including at least one first heat-generation element, a second housing including at least one second heat generation element, and a thermal hinge assembly configured to rotatably connecting the first and second housings with reference to a hinge axis, wherein the thermal hinge assembly includes a first hollow hinge member, a second hollow hinge member spaced apart from the first hollow hinge member along the hinge axis. a center hinge member disposed between the first and second hollow hinge members along the hinge axis, at least one heat transfer member that passes through the first and second hollow hinge members and the center hinge member, and thermally coupled with the first and second hollow hinge members and the center hinge member, a first rotation guide part coupled with one end of the center hinge member and the first hollow hinge member, and a second rotation guide part coupled with the other end of the center hinge member and the second hollow hinge member.