Thermal Housing with Phase-Change Material for Heat Dissipation
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Solution Overview
Problem
Integrated circuits face performance limitations due to heat dissipation issues, particularly in applications like telephony, where non-uniform heat intensity and thermal obstacles, such as low thermal conductivity materials, hinder effective heat dissipation.
Innovation Solution
An integrated structure with a thermally conducting heat dissipating housing, compatible with the chip in terms of thermal expansion, incorporating a phase-change material like paraffin, and a thermally conductive layer such as aluminum nitride, to store and release heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials with low thermal conductivity are used in the integrated structure, then the manufacturing is simpler, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a composite housing structure combining silicon body with aluminum nitride coating. The silicon provides structural integrity and compatibility with chip thermal expansion, while the aluminum nitride layer contributes high thermal conductivity (up to 300 W·m−1·K−1). This composite approach achieves superior heat dissipation without compromising manufacturability, as both materials can be integrated using standard semiconductor fabrication processes.
Solution Approach 2:
The thermal management solution applies local quality enhancement by coating only the internal cavity surfaces and specific heat dissipation pathways with thermally conductive aluminum nitride material. The silicon housing body maintains its inherent properties, while localized high-conductivity regions are created where heat transfer is most critical, optimizing overall thermal performance without requiring the entire structure to be made of high-conductivity material.
2Strength
If the housing is made rigid to preserve structural integrity, then the strength increases, but the thermal expansion compatibility with the chip deteriorates
Solution Approach 1:
The patent carefully selects and controls the material parameters of the housing, specifically the coefficient of thermal expansion (CTE) and Young's modulus. The silicon-based housing is designed with CTE between 2-5 ppm·K−1 to match typical chip materials, and Young's modulus between 50-190 GPa to provide appropriate flexibility. These parameter optimizations enable the housing to maintain structural integrity while accommodating thermal expansion differences during operation, preventing cracking and ensuring reliable chip-to-housing bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation capabilities, preserving the integrity of the chip by managing thermal expansion and improving thermal conductivity, thereby increasing the power and performance of integrated circuits.
Implementation Method 1
the heat dissipating housing may contain at least one phase-change material, for example paraffin, exhibiting a first phase change during which it stores the heat and a second phase change during which it releases the stored heat
Implementation Method 2
The storage capacity in latent heat of the housing is also advantageously chosen in view of the application envisaged
Implementation Method 3
the at least one cavity and the internal face of the cover are preferably coated with a thermally conductive layer. The material used for the thermally conductive layer can advantageously be aluminum nitride (AlN)
Implementation Method 4
Its compatibility with the chip in terms of thermal expansion notably means that, when the temperature increases, the thermal expansion of the housing preserves the integrity of the chip
Data Source
AI summary
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.