Thermal Imaging Camera Sensor Mount for Infrared Detector Cooling
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Solution Overview
Problem
Existing thermal imaging cameras face challenges in reducing thermal influences on infrared detectors, which can affect their performance and accuracy in measuring two-dimensional temperature information.
Innovation Solution
The thermal imaging camera incorporates a sensor mount that connects the infrared assembly to a cooling element, using thermally conductive materials and insulation to dissipate heat and protect the infrared assembly from mechanical and thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the infrared assembly is directly mounted in the housing, then the device structure is simple, but thermal influences from the housing affect the infrared detector performance
Solution Approach 1:
The patent introduces a sensor mount as an intermediary component between the housing and the infrared assembly. This sensor mount serves as a thermal barrier that mediates the thermal interaction, preventing heat from the housing from reaching the infrared detector while still providing mechanical support and positioning.
Solution Approach 2:
The patent segments the mounting structure into distinct functional components: the housing, the sensor mount, and the infrared assembly. This segmentation allows each component to be optimized independently - the housing for structural purposes, the sensor mount for thermal isolation, and the infrared assembly for detection performance.
2Reliability
If cooling elements are added to reduce thermal influences, then the infrared assembly performance is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into the sensor mount: mechanical support, thermal isolation, and positioning of the infrared assembly. By merging these functions into a single integrated component rather than adding separate cooling elements, the solution improves performance without proportionally increasing device complexity.
3Loss of energy
If thermally conductive materials are used to connect the infrared assembly to the cooling element, then heat dissipation is improved, but thermal interference from the cooling element may affect the detector
Solution Approach 1:
The patent applies different thermal conductivity properties to different regions and components. The sensor mount uses materials with specific thermal conductivity characteristics to allow controlled heat dissipation from the infrared assembly while maintaining thermal isolation from the housing and cooling elements, creating a localized thermal management solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal interference, ensuring accurate and reliable two-dimensional temperature measurement by maintaining the infrared assembly's performance and integrity.
Implementation Method 1
a sensor mount configured to connect the infrared assembly to the cooling element
Implementation Method 2
an infrared detector array consisting of a plurality of pixels sensitive to infrared radiation
Data Source
AI summary
A thermal imaging camera includes a housing, an infrared assembly for detecting infrared radiation, and a visual assembly for receiving visual radiation. The infrared assembly and the visual assembly are disposed substantially within the housing. The camera further includes at least one cooling element for cooling at least the infrared assembly. The thermal imaging camera also includes a sensor mount configured to connect the infrared assembly to the cooling element.