Thermal Insert and Spreader Design for Mobile Device Heat Management
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Solution Overview
Problem
Mobile devices face performance throttling and user discomfort due to inadequate heat management, leading to hot spots and reduced reliability as heat builds up from components like cameras and display backlights.
Innovation Solution
Incorporating thermal inserts made of materials like molybdenum and graphite-infused adhesives to direct and dissipate heat away from critical components and surfaces, such as between the camera and cover glass, and using flexible connectors to redirect thermal energy from LEDs, thereby managing thermal energy effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal inserts and thermal spreaders are added to manage heat, then heat dissipation is improved and hot spots are reduced, but device complexity increases
Solution Approach 1:
Thermal inserts and thermal spreaders are introduced as intermediary components between heat-generating components (camera, LED) and the device housing. These intermediaries redirect thermal energy away from external surfaces, managing heat without requiring fundamental redesign of the device structure.
Solution Approach 2:
The patent employs composite material structures, such as thermal inserts composed of molybdenum and graphite-infused adhesives, to achieve both thermal conduction and structural integration. This allows effective heat management while maintaining device integrity and reducing the number of separate components.
2Object-affected harmful factors
If thermal management features are implemented, then user comfort is improved by reducing hot spots, but manufacturing complexity increases
Solution Approach 1:
Thermal inserts are designed to be pre-formed and pre-positioned within the device assembly process. The thermal spreaders are applied to surfaces before final component installation, ensuring heat management pathways are established early in manufacturing and simplifying subsequent assembly steps.
Solution Approach 2:
The patent combines thermal management functions with existing structural components. For example, thermal inserts are integrated into the device frame or housing structures, and thermal spreaders are combined with adhesive layers, reducing the number of separate manufacturing steps and simplifying production.
3Temperature
If heat is directed away from the cover glass, then external surface temperature is reduced and user comfort is improved, but the thermal path becomes more complex
Solution Approach 1:
The thermal management system is segmented into distinct functional zones: thermal inserts positioned at specific heat-generating locations (camera, LED), thermal spreaders applied to relevant surfaces, and heat dissipation pathways routed through the device structure. This segmentation allows targeted heat management without requiring complete redesign of the entire thermal path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat absorption by external surfaces, prevents performance throttling, and enhances user comfort by maintaining device performance at higher brightness levels without overheating.
Implementation Method 1
a thermal insert that at least partially closes the opening and is secured to the frame. The thermal insert can be configured to direct the thermal energy away from the cover glass
Implementation Method 2
a thermal spreader configured to absorb thermal energy emitted by a component of the computing device
Implementation Method 3
an adhesive disposed between the thermal spreader and an internal surface of the computing device
Data Source
AI summary
This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.