Thermal Insulation Sheet with Microcapsules for Heat Management
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Solution Overview
Problem
Conventional electronic devices face challenges in effectively dissipating heat generated by high-performance components, particularly during sudden increases in heat generation, which can lead to increased interconnection resistance, power consumption, and reduced battery life.
Innovation Solution
A thermal insulation sheet comprising a heat storage sheet made of resin with encapsulated powdery microcapsules, a highly-thermoconductive sheet, and an insulation sheet, where the heat storage sheet has a void ratio of 10-30% and surface roughness of 2-20 μm, allowing for efficient heat radiation and temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a high thermoconductivity heat diffusion sheet is used to dissipate heat, then heat dissipation capability is improved, but the ability to suppress temporary temperature rise during instantaneous heat generation increases
Solution Approach 1:
The patent employs latent-heat storage agents that undergo phase transitions (solid-liquid) at specific temperatures to absorb excess heat during instantaneous heat generation. The microcapsules containing these agents expand during phase change, absorbing heat and suppressing temporary temperature rise, while the heat storage sheet structure enables this phase transition mechanism to function effectively.
Solution Approach 2:
The patent optimizes the void ratio parameter of the heat storage sheet to 10-30% to balance heat conduction pathways with heat radiation capability. This parameter change enables the sheet to both conduct heat efficiently and radiate excess heat, suppressing temporary temperature rise while maintaining overall heat dissipation capability.
2Duration of action of stationary object
If conventional heat diffusion sheets are used, then continuous heat dissipation is achieved, but suppression of temperature rise during instantaneous heat generation is insufficient
Solution Approach 1:
The heat storage sheet is pre-loaded with latent-heat storage agents in microcapsule form during manufacturing. When instantaneous heat generation occurs, these pre-positioned agents immediately undergo phase transition to absorb the sudden heat input, suppressing temperature rise before it can affect the heat-generating component.
Solution Approach 2:
The patent creates a composite structure combining heat storage sheet material with latent-heat storage agents encapsulated in microcapsules. This composite material integrates both heat conduction functionality and latent heat storage capability, enabling simultaneous continuous heat dissipation and suppression of instantaneous temperature rise.
3Temperature
If heat storage sheet with high void ratio is used, then heat radiation capability is improved, but structural integrity and heat conduction may be compromised
Solution Approach 1:
The patent optimizes the void ratio parameter to a specific range of 10-30%, which balances heat radiation capability with structural integrity. This parameter optimization ensures that the heat storage sheet has sufficient porosity for heat radiation while maintaining enough solid material framework to preserve structural strength and mechanical properties.
Solution Approach 2:
The patent creates local quality variations within the heat storage sheet structure, where regions with higher void ratios enhance heat radiation while regions with lower void ratios maintain structural integrity. The microcapsule distribution and sheet thickness can be varied locally to optimize both heat radiation and structural properties in different areas of the sheet.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses rapid temperature rises in heat-generating components, enhancing heat dissipation and reducing power consumption by utilizing the latent heat storage agent and high thermoconductivity, thereby improving the performance and longevity of electronic devices.
Implementation Method 1
The powdery microcapsules encapsulate latent-heat storage agent
Implementation Method 2
The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent.
Implementation Method 3
a highly-thermoconductive sheet affixed to the insulation sheet
Implementation Method 4
The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 μm and not more than 20 μm.
Data Source
AI summary
A thermal insulation sheet includes a heat storage sheet, an insulation sheet affixed to the heat storage sheet, and a highly-thermoconductive sheet affixed to the insulation sheet. The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent. The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 μm and not more than 20 μm. The thermal insulation sheet suppresses or retards transferring of heat generated in a heat-generating component to outside, and suppresses a rapid rising of a temperature of the heat-generating component.