Thermal Insulator Plenum for Heat Transfer Reduction
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Solution Overview
Problem
Information handling systems face challenges in managing heat transfer from high-power components, leading to elevated enclosure temperatures that can be uncomfortable for users, particularly in portable devices like laptops and handheld devices.
Innovation Solution
A thermal management system comprising a planar first member, a planar second member, and a gasket that defines a plenum to prevent fluid transfer between the interior and exterior, minimizing heat transfer between heat-producing components and the enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then heat transfer from components is achieved, but enclosure temperature becomes unsafe or uncomfortable for users
Solution Approach 1:
The enclosure space is segmented into multiple thermal zones using thermal barriers and insulation layers. Heat-generating components are isolated from the enclosure interior by creating distinct thermal compartments, preventing direct heat transfer to the enclosure while maintaining effective heat dissipation pathways.
Solution Approach 2:
The patent employs composite thermal management structures combining different materials with varying thermal conductivities. Thermal barriers utilize materials with low thermal conductivity to block heat transfer, while heat dissipation pathways use high-conductivity materials to conduct heat away from components, creating a composite system that simultaneously prevents and facilitates heat transfer in different regions.
2Loss of energy
If heat dissipation pathways are created, then heat transfer efficiency improves, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into unified thermal management components. Enclosure structures serve dual purposes as both mechanical housing and thermal barriers, while heat dissipation pathways are incorporated into existing component mounting structures. This multi-functionality reduces the need for separate dedicated thermal management components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent combines thermal management functions with structural components. Thermal barriers are integrated into enclosure walls, and heat dissipation pathways are merged with component mounting structures and airflow channels. By merging thermal management with existing structural elements, the design achieves effective heat dissipation without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat transfer, maintaining the enclosure temperature below 55°C, enhancing user comfort and device safety by primarily utilizing conduction over convection for heat dissipation.
Implementation Method 1
The solution effectively reduces heat transfer, maintaining the enclosure temperature below 55°C, enhancing user comfort and device safety by primarily utilizing conduction over convection for heat dissipation.
Data Source
AI summary
In accordance with embodiments of the present disclosure, an apparatus for minimizing heat transfer may include a first member substantially planar in shape, a second member substantially planar in shape and substantially perpendicular to the first member, and a gasket mechanically coupling the first member to the second member. The apparatus may be formed such that the first member, second member, and the gasket define a plenum wherein the first member, the second member, and the gasket prevent transfer of fluid between an interior and exterior of the plenum.