Thermal Interconnect Structure for Heat Dissipation in Chip Interconnects
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Solution Overview
Problem
As semiconductor devices and memory devices on integrated chips generate heat due to signal travel, this heat can become trapped in low thermal conductivity dielectric layers, leading to damage and performance degradation, especially as device density increases and interconnect structures become more compact.
Innovation Solution
A thermal interconnect structure is integrated within the electrical interconnect structure, comprising thermal vias, thermal wires, and thermal layers made of non-conductive materials with higher thermal conductivity than the dielectric layers, providing pathways for heat dissipation without interfering with signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device density is increased by reducing minimum feature sizes, then integration density of electronic components is improved, but heat build-up worsens due to closely arranged components trapping heat in dielectric layers
Solution Approach 1:
The interconnect structure is segmented into electrical interconnect elements (wires, vias) and separate thermal interconnect elements (thermal vias, thermal wires). This segmentation allows the thermal management function to be independently optimized without interfering with electrical signal transmission, directly addressing the heat build-up problem while maintaining high device density
Solution Approach 2:
A thermal interconnect structure acts as an intermediary between the heat-generating electronic components and the heat sink. This intermediate thermal pathway efficiently conducts heat away from the densely packed components through dedicated thermal vias and wires, preventing heat trapping in dielectric layers while preserving the high integration density
2Temperature
If thermal interconnect structure is integrated within electrical interconnect structure, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The thermal interconnect structure is merged with the existing electrical interconnect structure by integrating thermal vias and thermal wires into the same interconnect layers. This merging approach enables heat dissipation functionality to be added without creating entirely separate thermal management structures, thereby limiting the increase in device complexity while improving heat dissipation
Solution Approach 2:
The interconnect structure is designed with multi-functionality, where certain interconnect elements serve both electrical and thermal functions. By making the thermal interconnect structure an integral part of the existing interconnect architecture, the system achieves efficient heat dissipation without proportionally increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal interconnect structure effectively dissipates heat away from the integrated chip, reducing the risk of damage and enhancing the reliability and longevity of semiconductor devices and memory devices.
Implementation Method 1
the thermal interconnect structure is arranged within the interconnect dielectric layers... the thermal interconnect structure effectively dissipates heat away from the integrated chip
Data Source
AI summary
In some embodiments, the present disclosure relates to an integrated chip that includes an electrical interconnect structure, a thermal interconnect structure, and a thermal passivation layer over a substrate. The electrical interconnect structure includes interconnect vias and interconnect wires embedded within interconnect dielectric layers. The thermal interconnect structure is arranged beside the electrical interconnect structure and includes thermal vias, thermal wires, and/or thermal layers. Further, the thermal interconnect structure is embedded within the interconnect dielectric layers. The thermal passivation layer is arranged over a topmost one of the interconnect dielectric layers. The thermal interconnect structure has a higher thermal conductivity than the interconnect dielectric layers.