Thermal Interconnect Members for Hotspot Cooling in IC Packages
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Solution Overview
Problem
Conventional cooling methods for integrated circuit (IC) packages are inadequate and expensive, particularly in addressing hotspots on semiconductor dice, as they often require exotic and costly fluid circulation or micro-refrigeration systems, which are not suitable for cost-sensitive applications.
Innovation Solution
The implementation of thermal interconnect members, which are thermally and electrically conductive, are attached to hotspots on the IC die, providing direct heat transfer paths through a mold compound to the external environment, either alone or in conjunction with a heat spreader, to selectively cool hotspots while minimizing cooling of cooler areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (fluid circulation or micro-refrigeration systems) are used to cool hotspots on IC dies, then cooling effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the cooling function from complex fluid circulation or micro-refrigeration systems and implements it through simple thermal interconnect members that conduct heat away from hotspots. The thermal interconnect members are discrete elements attached directly to hotspot locations, eliminating the need for complex cooling infrastructure while maintaining effective heat removal.
Solution Approach 2:
The patent employs simple, inexpensive thermal interconnect members made from readily available thermally conductive materials rather than expensive micro-refrigeration components. These thermal interconnects are straightforward conductive elements that provide adequate cooling without the high cost and complexity of active refrigeration systems.
2Temperature
If conventional cooling methods are used, then hotspot cooling is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive micro-refrigeration systems and fluid circulation infrastructure with inexpensive thermal interconnect members made from common thermally conductive materials. These simple conductive elements dramatically reduce manufacturing costs while maintaining effective hotspot cooling performance.
Solution Approach 2:
The thermal interconnect members passively conduct heat away from hotspots through thermal conduction without requiring external power sources, control systems, or maintenance. This self-service cooling approach eliminates the operational costs and manufacturing expenses associated with active cooling systems.
3Temperature
If thermal interconnect members are attached to hotspots, then selective cooling of hotspots is improved, but device complexity increases
Solution Approach 1:
The patent applies thermal interconnect members selectively at specific hotspot locations on the IC die rather than implementing uniform cooling across the entire device. This localized approach addresses temperature variations at problem areas while leaving cooler regions unaffected, achieving thermal uniformity without the complexity of system-wide cooling modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat removal from specific hotspots, improving thermal uniformity and reducing overall power consumption, making it a cost-effective and reliable solution for IC package cooling.
Implementation Method 1
thermal interconnect members, which are thermally and electrically conductive, are attached to hotspots on the IC die, providing direct heat transfer paths through a mold compound to the external environment
Implementation Method 2
providing direct heat transfer paths through a mold compound to the external environment
Data Source
AI summary
Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is located on a hotspot of the IC die. The hotspot is thermally coupled to a thermal interconnect member. In an aspect, the package is encapsulated in a mold compound. In a further aspect, a heat spreader is attached to the mold compound, and is thermally coupled to the thermal interconnect member. In another aspect, a thermal interconnect member thermally is coupled between the heat spreader and the substrate.