Thermal Interface Aging Detection in Electronic Component Inspection

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Solution Overview

Problem

Existing electronic component inspection systems struggle to monitor the aging status and quality of the thermal interface between the electronic component and the inspection device in real-time, leading to potential high temperatures and component failures.

Innovation Solution

An inspection system with a thermal interface that includes a test socket, a temperature regulator, and a controller, which uses temperature sensing units on the electronic component to detect temperature changes and assess the thermal interface's quality and aging status in real-time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is used to fill gaps between the pressing mechanism and electronic component, then heat dissipation is improved, but the system cannot detect when the thermal interface material deteriorates

Engineering Contradiction:
Improveheat dissipationVSAvoidaging detection capability
Core Design Contradiction:
TemperatureVSLoss of information

Solution Approach 1:

The patent incorporates temperature sensing units and monitoring circuits that continuously measure the temperature at the thermal interface between the pressing mechanism and electronic component. This preliminary monitoring detects thermal interface material deterioration before it causes component failure, allowing proactive maintenance or replacement of the thermal interface material.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If real-time monitoring of thermal interface quality is implemented, then component failure is prevented, but device complexity increases

Engineering Contradiction:
Improvecomponent failure preventionVSAvoidmonitoring system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates temperature sensing units and monitoring circuits into the existing inspection device structure, allowing the same device to perform both its primary inspection function and thermal interface monitoring function. This multi-functionality reduces the need for separate dedicated monitoring equipment, thereby limiting the increase in device complexity while achieving real-time thermal interface quality monitoring.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables real-time monitoring of the thermal interface's quality and aging status, improving the efficiency and yield of electronic component inspections by preventing high temperatures and component failures.

Implementation Method 1

The temperature regulator is suitable for regulating a temperature of the electronic component to be tested, and the thermal interface is between the temperature regulator and the electronic component to be tested

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

temperatures at locations of the plurality of temperature sensing units are detected through the plurality of temperature sensing units

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Data Source

PatentUS20250027987A1Inspection system with thermal interface, and electronic component inspection device and method
Publication Date: 2025.01.23 CHROMA ATE INC
  • US20250027987A1 patent drawing
  • US20250027987A1 patent drawing
  • US20250027987A1 patent drawing

AI summary

An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.