Thermal Interface Assembly With Anti-Overflow Phase Change Sheet
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Solution Overview
Problem
Phase change materials used in electronic assemblies, such as gaming laptops, tend to overflow between the processor and copper block after melting, reducing heat transfer efficiency and potentially damaging adjacent components.
Innovation Solution
Incorporating an anti-overflow element made of Indium, which surrounds a thermally conductive sheet made of an Indium-Bismuth-Tin alloy, preventing the liquid phase change material from overflowing by maintaining thermal contact and using an anti-overflow part with an opening to expose the phase change material, ensuring continuous heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If phase change material is placed between processor and copper block for heat transfer, then heat transfer efficiency is improved, but liquid phase change material overflows after melting causing damage to surrounding components
Solution Approach 1:
An anti-overflow element made of indium is introduced as an intermediary component between the phase change material and the surrounding electronic components. This element contains the liquid phase change material after melting while maintaining thermal contact, preventing overflow damage to surrounding components while preserving heat transfer efficiency.
Solution Approach 2:
The anti-overflow element functions as a containment structure that flexibly accommodates the phase change material in both solid and liquid states. The element's design allows it to conform to the space between the processor and copper block while preventing liquid escape, effectively acting as a flexible containment shell.
2Object-affected harmful factors
If anti-overflow element is added to contain liquid phase change material, then overflow prevention is achieved, but device complexity increases
Solution Approach 1:
The anti-overflow element performs multiple functions simultaneously: it contains the liquid phase change material to prevent overflow, maintains thermal contact between the processor and copper block, and provides structural support. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The anti-overflow element is integrated with the phase change material and the surrounding structural components, merging the containment function with the existing thermal management structure. This integration approach minimizes the addition of separate parts and simplifies the overall assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anti-overflow element effectively maintains heat transfer efficiency between the heat source and thermally conductive block, preventing damage to surrounding components by containing the liquid phase change material, and enhancing the reliability of the electronic assembly.
Implementation Method 1
The thermally conductive sheet is made of a phase change material. Opposite sides of the thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively
Implementation Method 2
the heat generated by the processor can be effectively transferred to the copper block via the liquid phase change material
Implementation Method 3
The thermally conductive sheet is located in the opening of the anti-overflow element to be surrounded by the anti-overflow element
Data Source
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AI summary
The disclosure provides electronic assembly (10), method for manufacturing electronic assembly, and composite thermally conductive sheet (20b). The electronic assembly includes circuit board (100), heat source (200), anti-overflow element (300), thermally conductive block (400) and thermally conductive sheet (500). The heat source is disposed on and electrically connected to the circuit board. The anti-overflow element is disposed on a side of the heat source located farthest away from the circuit board and has an opening (303). The thermally conductive block is disposed on a side of the anti-overflow element located farthest away from the heat source. The thermally conductive sheet is made of a phase change material. The thermally conductive sheet is located in the opening of the anti-overflow element to be surrounded by the anti-overflow element. Opposite sides of the thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively.