Multi-Layer Thermal Interface Material for High-Power CCA Heat Dissipation
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Solution Overview
Problem
Current metal-to-metal thermal interfaces between circuit card assemblies (CCAs) and chassis are inadequate for high-power devices due to insufficient heat transferability, leading to increased thermal resistance and performance issues as electronic devices become smaller and operate at higher speeds.
Innovation Solution
A thermal interface material comprising a thermally conductive metal with a diffusion barrier plate and a thermal resistance reducing layer, typically copper, nickel, and indium layers, is used to enhance heat transfer between the CCA and the chassis, reducing thermal resistance by at least a factor of 10.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal-to-metal thermal interface is used between CCA and chassis, then the structure is simple and manufacturing is easy, but thermal resistance is high and heat transferability is insufficient
Solution Approach 1:
The patent applies composite materials by creating a multi-layer thermal interface material structure consisting of a copper core layer, nickel diffusion barrier layers, and indium thermal resistance reducing layers. This composite structure combines the high thermal conductivity of copper with the low thermal resistance properties of indium, while using nickel to prevent diffusion between layers. The composite material resolves the contradiction by achieving superior thermal performance without significantly complicating the manufacturing process.
Solution Approach 2:
The patent uses an intermediary approach by introducing a multi-layer material system between the CCA and chassis that acts as a thermal mediator. The indium layers specifically serve as thermal intermediaries that reduce contact resistance at the interfaces, while the nickel layers mediate to prevent unwanted diffusion. This intermediary structure enables effective heat transfer that neither metal-to-metal contact nor simple thermal paste can achieve.
2Productivity
If CCA components are made smaller to increase component density, then more components can be contained, but heat generation per CCA increases and thermal management becomes more difficult
Solution Approach 1:
The patent applies parameter changes by fundamentally altering the thermal interface material properties through the multi-layer structure. The copper core provides high thermal conductivity, while the indium layers reduce contact thermal resistance by over 80% compared to metal-to-metal interfaces. This parameter change in the thermal interface material enables effective heat dissipation from high-density, small-component CCAs that generate excessive heat.
3Power
If high power devices are used to increase processing capability, then more heat is generated, but the existing thermal interface cannot dissipate the heat effectively
Solution Approach 1:
The patent uses composite materials with a copper core and indium surface layers to achieve high thermal conductivity throughout the interface. The copper core efficiently conducts heat from high-power devices, while the indium layers ensure low thermal resistance at the contact interfaces. This composite structure enables effective heat dissipation from high-power processing devices, converting the harmful heat loss into efficiently managed thermal energy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal interface material significantly reduces thermal resistance, enabling efficient heat dissipation in CCAs with loads ranging from lower than 20 watts to greater than 160 watts, maintaining optimal performance even under high heat generation conditions.
Implementation Method 1
Enclosures designed to remove heat from a CCA by way of thermal conduction
Implementation Method 2
a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal
Data Source
AI summary
The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.