Thermal Interface Material With Conductive Fibers
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Solution Overview
Problem
Conventional thermal management systems for electronic devices are bulky and heavy, making them unsuitable for wearable devices, and they often inefficiently manage heat due to random distribution of added materials which leads to thermal energy transfer inefficiencies.
Innovation Solution
A thermal management system utilizing a thermally conductive silicone matrix with aligned thermally conductive fibers, such as carbon or graphite, that forms a pathway for efficient thermal energy transfer, coupled with a flexible and highly conductive thermal conduit, to effectively draw and disperse heat away from sensitive areas in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management systems are used, then heat dissipation function is provided, but the device becomes bulky and heavy
Solution Approach 1:
The patent changes the physical parameters of the thermal management system by using a phase change material with specific melting point (25°C to 35°C) and latent heat of fusion (200 to 400 J/g). This phase change mechanism provides efficient heat dissipation without requiring bulky conventional cooling systems, thereby reducing device weight while maintaining temperature control.
Solution Approach 2:
The patent employs a composite structure consisting of a biocompatible polymer matrix combined with thermally conductive particles (such as aluminum oxide, zinc oxide, or titanium dioxide). This composite material achieves high thermal conductivity and effective heat dissipation in a compact form factor, eliminating the need for heavy conventional thermal management components.
2Temperature
If added materials are randomly distributed in thermal interface material, then thermal conductivity is improved, but thermal energy transfer efficiency decreases
Solution Approach 1:
The patent applies local quality by creating regions of high thermal conductivity pathways through the organized arrangement of phase change material and thermally conductive particles. Instead of random distribution, the material structure is designed to channel thermal energy efficiently from heat-generating components to heat dissipation areas, reducing thermal resistance and improving energy transfer efficiency.
Solution Approach 2:
The patent ensures continuous thermal energy transfer by establishing uninterrupted thermal pathways through the phase change material. As the material undergoes phase change from solid to liquid and back, it maintains continuous contact with heat-generating components, ensuring uninterrupted heat dissipation and eliminating thermal gaps that would reduce efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced thermal conductivity and efficient heat dissipation, preventing hotspots and ensuring user comfort in wearable devices by directing thermal energy to less sensitive areas, while being compact and lightweight, suitable for various electronic devices.
Implementation Method 1
the thermal energy may be transferred across the thermal interface material via conduction as the thermal energy is transferred along a length of individual thermally conductive fibers
Implementation Method 2
the material has a melting point between 25°C and 35°C and a latent heat of fusion between 200 and 400 J/g
Data Source
AI summary
An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.