Thermal Interface Material with Oriented Heat Conduction Channels
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Solution Overview
Problem
Existing heat-conducting materials used in electronic equipment face challenges in achieving high heat conductivity, appropriate hardness, and electrical insulation, which are crucial for the efficient operation and longevity of miniaturized electronic devices.
Innovation Solution
A preparation method involving stirring and mixing of alkenyl-containing siloxane with liquid silica gel, metal powder, metal oxide, and ceramic material, followed by orientation, vacuum compacting, and curing to create a heat-conducting interface material with directional carbon material distribution, forming heat conduction channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conducting filler content is increased to improve heat conductivity, then thermal conductivity is improved, but material hardness and electrical insulation may deteriorate
Solution Approach 1:
The patent employs a composite material system comprising silicone rubber base material, thermal conducting fillers (such as aluminum oxide, aluminum nitride, or boron nitride), and reinforcing fillers. This composite structure allows the material to simultaneously achieve high thermal conductivity through the thermal conducting fillers while maintaining appropriate hardness and electrical insulation through the silicone rubber matrix and optimized filler content ratios.
Solution Approach 2:
The patent optimizes the content ratios of different fillers and the base material to achieve the desired balance. By carefully controlling the filler content within specific ranges and adjusting the particle size distribution, the material achieves high thermal conductivity without compromising hardness or electrical insulation properties.
2Temperature
If thermal conducting filler content is increased to improve heat conductivity, then thermal conductivity is improved, but electrical insulation may deteriorate
Solution Approach 1:
The silicone rubber base material serves as an electrical insulating matrix that surrounds and isolates the thermal conducting fillers. This composite structure enables the material to conduct heat effectively through the filler network while the silicone rubber matrix maintains electrical insulation by preventing electrical conductivity pathways between fillers.
Solution Approach 2:
The patent creates different functional zones within the material: thermal conducting fillers provide heat conduction pathways in specific regions, while the silicone rubber matrix provides electrical insulation throughout. This local differentiation of functions allows simultaneous optimization of thermal conductivity and electrical insulation.
3Temperature
If carbon fibers are oriented in thickness direction to improve heat conduction, then thermal conductivity in thickness direction is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs vibration during the molding process to orient carbon fibers in the thickness direction. The vibration causes the carbon fibers to align perpendicular to the mold surface, achieving the desired orientation for improved thermal conductivity in the thickness direction without requiring complex alignment equipment or multi-step processes.
Solution Approach 2:
The patent optimizes vibration parameters (frequency, amplitude, duration) during molding to achieve effective carbon fiber orientation. By carefully controlling these parameters, the process achieves good fiber alignment and thermal conductivity while keeping the manufacturing process relatively simple and equipment requirements moderate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a heat-conducting interface material with excellent thermal conductivity and appropriate hardness, suitable for effective heat dissipation in electronic products, enhancing their stability and reliability.
Implementation Method 1
putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle and arranging the material neatly in a container in a strip shape
Implementation Method 2
putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle
Implementation Method 3
vibrating the material in a vibrating compactor and repeatedly performing stacking 2-4 times
Implementation Method 4
vacuum compacting
Implementation Method 5
curing
Implementation Method 6
heat-conducting interface material with excellent thermal conductivity
Data Source
AI summary
The present invention pertains to the technical field of thermally conductive materials, and specifically relates to a method for preparing a thermally conductive interface material. Disclosed is a method for preparing a thermally conductive interface material, comprising the following steps: S1. stirring and mixing; S2. orientation process: placing the mixed material obtained in step S1 into a hydraulic injection extruder, discharging the extruded material through a needle nozzle, neatly arranging the material in strips in a container, and after stacking the materials to a height of 1/2 to 1/4, vibrating and compacting the material in a vibrating compactor, and repeating the stacking 2 to 4 times; S3. vacuum compaction; S4. curing; and S5. slicing.