Thermal Interface Arrangement with Insulating Biasing

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Solution Overview

Problem

Diagnostic devices face challenges in achieving precise and efficient heating of biological samples due to the limitations of existing thermal interfaces in disposable test cartridges, which require repeatable and reliable heat transfer without increasing costs or complexity.

Innovation Solution

A thermal interface arrangement featuring a thermally conductive interface member supported by a rigid substrate and biased by thermally insulating flexible members, allowing for efficient heat transfer to the sample without the need for permanent attachment, and integrated with a heater system that uses LEDs for non-contact heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a copper plate is added to the test cartridge to improve thermal interface performance, then heat transfer efficiency is improved, but the cost and manufacturing complexity increase

Engineering Contradiction:
Improvethermal interface performanceVSAvoidcartridge component count
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The copper plate thermal interface component is extracted from the disposable test cartridge and relocated to the reusable main device. This eliminates the need for expensive components in the disposable cartridge while maintaining thermal interface performance through the use of inexpensive aluminum or plastic alternatives.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The test cartridge uses inexpensive aluminum or plastic thermal interface plates instead of expensive copper, appropriate for disposable use. The reusable main device contains the expensive thermal management components, optimizing the cost-effectiveness of the disposable component.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Stability of the object's composition

If adhesive is used to attach the copper plate to the cartridge housing, then thermal interface stability is improved, but manufacturing steps and cost increase

Engineering Contradiction:
Improvethermal interface contact stabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The adhesive attachment process is eliminated by removing the copper plate requirement from the disposable cartridge. The simplified cartridge design uses mechanical engagement or snap-fit features instead of adhesive bonding.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The thermal interface system is segmented into two parts: a simple disposable cartridge with basic thermal contact features, and a reusable main device with advanced thermal management including the heated plate and control electronics.

Inventive Principle:
Principle #1Segmentation

3Manufacturing precision

If the heating component is integrated into the disposable cartridge, then heating precision is improved, but the cost and complexity of the disposable component increase

Engineering Contradiction:
Improveheating control precisionVSAvoiddisposable cartridge complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heating component (LEDs, heated plate, control electronics) is extracted from the disposable cartridge and relocated to the reusable main device. The disposable cartridge contains only passive sample processing components, maintaining simplicity and low cost.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The reusable main device serves multiple functions: it houses the heating elements, controls thermal cycling, processes test data, and can accommodate multiple different disposable cartridge types, providing multi-functionality at the system level rather than in each disposable unit.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable, efficient, and cost-effective heating of biological samples by maximizing heat transfer to the sample while minimizing thermal bridges and allowing for independent temperature control of different heating zones, enhancing the performance and disposability of diagnostic devices.

Implementation Method 1

The interface member comprises a thermally conductive layer that is supported by a rigid substrate layer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The, or each, biasing member comprises thermally insulating material, so that the biasing member is configured to resist heat transfer away from the interface member

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

The interface member may be heated using a non-contact technique, for example using LEDs within the device to irradiate the plate

Methodology Applied
Scientific EffectPhotothermal conversion: Absorption (EM radiation)

Data Source

PatentUS20250024584A1Thermal interface arrangement
Publication Date: 2025.01.16 GENOMTEC SA
  • US20250024584A1 patent drawing
  • US20250024584A1 patent drawing
  • US20250024584A1 patent drawing

AI summary

A thermal interface arrangement for a heater system, the thermal interface arrangement being arranged for establishing a thermal interface with a body to be heated, the arrangement including a support structure and at least one interface assembly mounted on the support structure. The interface assembly includes an interface member arranged to engage the body to form a thermal interface, and at least one biasing member acting between the support structure and the interface member to bias the interface member away from the support structure and into engagement with the body, in use. The biasing member includes thermally insulating material so that the biasing member is configured to resist heat transfer from the interface member to the support structure.