Thermal Interface Material with Ion Scavenger for Polymer Degradation

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Solution Overview

Problem

Thermal interface materials degrade rapidly due to metal ion catalysis, leading to premature failure in electronic heat management systems, as metal surfaces catalyze polymer chain scission and unwanted crosslinking reactions.

Innovation Solution

Incorporating an ion scavenger, such as complexing agents like acid amide compounds or triazole compounds, into the thermal interface material to capture and bind metal ions, preventing them from initiating free radical formation and thereby inhibiting degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is used to transfer heat from electronic components, then heat dissipation efficiency is improved, but the material degrades rapidly due to metal ion catalysis leading to premature failure

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmaterial durability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent introduces an ion scavenger as an intermediary substance within the thermal interface material that selectively binds to metal ions (copper, aluminum, nickel) released from heat spreaders and heat sinks. This intermediary component prevents direct interaction between metal ions and polymer chains, blocking the catalytic degradation process while maintaining thermal conductivity function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal interface material is formulated as a composite system combining polymer base materials with thermally conductive fillers and ion scavenger additives. This composite structure integrates multiple functions: heat transfer capability from conductive fillers, degradation prevention from ion scavengers, and structural flexibility from polymer matrix, resolving the contradiction between thermal performance and long-term stability

Inventive Principle:
Principle #40Composite materials

2Temperature

If metal surfaces are used for heat spreading, then thermal conductivity is improved, but metal ions catalyze polymer chain scission and crosslinking reactions

Engineering Contradiction:
Improvethermal conductivityVSAvoidpolymer composition stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The ion scavenger acts as a chemical intermediary that intercepts metal ions before they can catalyze degradation reactions. The scavenger forms stable complexes with copper, aluminum, and nickel ions, preventing these ions from initiating free radical formation and subsequent polymer chain scission or crosslinking

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful presence of metal ions into a beneficial function by using the ion scavenger to selectively bind and immobilize metal ions. The metal ions that would otherwise cause degradation are captured and held in stable complexes, transforming a detrimental factor into a controlled component of the system

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ion scavenger significantly enhances the thermal stability of the material, as evidenced by increased Oxygen Induced Time (OIT) and resistance to degradation under accelerated stress tests, maintaining thermal impedance and preventing visible degradation.

Implementation Method 1

Incorporating an ion scavenger, such as complexing agents like acid amide compounds or triazole compounds, into the thermal interface material to capture and bind metal ions

Methodology Applied
Scientific EffectComplexation: Chemical Bonding

Implementation Method 2

Thermal interface materials (TIMs) are widely used to dissipate heat from electronic components, such as central processing units, video graphics arrays, servers, game consoles, smart phones, LED boards, and the like

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3166999B1Thermal interface material with ion scavenger
Publication Date: 2023.03.08 HONEYWELL INTERNATIONAL INC
  • EP3166999B1 patent drawingFigure 1
  • EP3166999B1 patent drawingFigure 2A
  • EP3166999B1 patent drawingFigure 2B

AI summary

A thermal interface material includes at least one polymer,at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of : nitrogen containing complexing agents,phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.