Thermal Interface Material Composition for High Conductivity and Low Abrasion
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Solution Overview
Problem
Current thermal interface materials face challenges such as insufficient thermal conductivity, difficulty in production, high costs, and abrasiveness, which hinder their effectiveness in thermal management for electric vehicle batteries and other applications.
Innovation Solution
A thermal interface material comprising an oligomeric or polymeric matrix phase with aluminum hydroxide fillers having a broad particle size distribution and a surface modifier, which enhances thermal conductivity while being non-abrasive and cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity fillers are used, then thermal conductivity is improved, but viscosity increases and processability deteriorates
Solution Approach 1:
The patent applies parameter changes by carefully controlling the particle size distribution parameters (D10, D50, D90 values and their ratios) of the filler particles. By optimizing these size parameters, the composition achieves high thermal conductivity while maintaining low viscosity and good processability. The specific parameter ranges disclosed (e.g., D50 between 1-10 μm, D90/D50 ratio between 1.5-3.0) demonstrate how parameter optimization resolves the contradiction between thermal conductivity and processability.
Solution Approach 2:
The patent uses composite materials by combining filler particles with a polymer matrix to create a thermal interface material. The composite structure allows the filler particles to provide thermal conductivity while the polymer matrix maintains processability and fills gaps between components. This composite approach enables simultaneous achievement of high thermal conductivity and good processability.
2Manufacturing precision
If filler particle size is reduced to improve gap filling, then contact quality is improved, but viscosity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the particle size distribution parameters to achieve fine particle sizes for good gap filling while controlling the overall viscosity. The specific parameter ranges (D50 between 1-10 μm, D90/D50 ratio between 1.5-3.0) balance the need for small particles to fill gaps with the need to maintain low viscosity for processability.
3Temperature
If high filler loading is used to improve thermal conductivity, then thermal performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies parameter changes by optimizing the particle size distribution parameters to achieve high filler loading (60-95 wt%) while maintaining good processability. The specific size parameters (D50 between 1-10 μm, D90/D50 ratio between 1.5-3.0) enable efficient packing of filler particles, allowing high loading levels without excessive viscosity increase, thereby reducing manufacturing costs.
4Temperature
If conventional fillers are used, then thermal conductivity is improved, but abrasiveness increases damaging equipment
Solution Approach 1:
The patent applies parameter changes by selecting filler particles with specific size parameters (D50 between 1-10 μm, fine particle size distribution) that provide high thermal conductivity while being inherently less abrasive. The fine particle size range reduces mechanical abrasiveness compared to coarser conventional fillers, protecting processing equipment while maintaining thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material achieves high thermal conductivity of 2.0 W/mK or more, improved processability, and reduced manufacturing costs, making it suitable for efficient thermal management in electric vehicle batteries and other devices.
Implementation Method 1
a dispersed filler phase including conductive filler dispersed in the matrix phase, wherein the filler includes aluminum hydroxide
Implementation Method 2
wherein the filler is covered and/or reacted with a surface modifier
Data Source
Figure 1(A)~3
Figure 4(A)~5
Figure 6
AI summary
The teachings herein relate to new compositions for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive. The improved thermal conductivity is achieved using a combination of increased filler loading, selection of a filler having a broad particle size distribution, and selection of filler that is non-abrasive. In order to achieve maximum thermal conductivity, the combination of the liquid matrix material and the filler preferably are chosen to avoid forming bonds between filler particles. Such bonds can also be avoided by including a surface modifier that modifies the surface of the filler particles.