Thermal Interface Materials with Low Secant Modulus

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Solution Overview

Problem

There is a need for thermal interface materials with low thermal resistance and high thermal conductivity that can be easily deflected to a thin bondline with minimal pressure application, while maintaining low secant modulus of elasticity to prevent damage to delicate components.

Innovation Solution

The development of thermal interface materials with a combination of high thermal conductivity and low secant modulus of elasticity, achieved by using a base resin loaded with thermally-conductive fillers such as alumina and aluminum, which allows for efficient heat transfer and compliance to prevent pressure buildup during deflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface materials with high thermal conductivity are used, then heat transfer efficiency is improved, but the material becomes more rigid and requires higher pressure to deflect to thin bondline

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidrigidity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The patent modifies the material parameters by controlling the filler loading concentration and particle size distribution. By optimizing these parameters, the material achieves high thermal conductivity while maintaining low secant modulus of elasticity, allowing deflection to thin bondlines at low pressures without requiring higher pressure application

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials consisting of a polymer matrix combined with thermally-conductive fillers. This composite structure enables the material to simultaneously achieve high thermal conductivity from the fillers and low rigidity from the polymer matrix, resolving the contradiction between heat transfer efficiency and material rigidity

Inventive Principle:

Principle #40Composite materials

2Temperature

If pressure is applied to deflect material to thin bondline, then thermal contact resistance is reduced, but delicate components may be damaged

Engineering Contradiction:

Improvethermal contact resistanceVSAvoidpressure-induced damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent changes the mechanical parameters of the material by reducing the secant modulus of elasticity through optimized filler loading and particle size. This parameter change allows the material to achieve thin bondlines and low thermal contact resistance through its own compliance rather than through high external pressure, thereby preventing damage to delicate components

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The material serves itself by using its inherent low secant modulus of elasticity to achieve deflection to thin bondlines without requiring high external pressure. The material's own mechanical properties enable it to conform to the bonding surfaces and achieve low thermal contact resistance autonomously, eliminating the need for damaging high-pressure application

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These materials enable effective heat transfer with low thermal resistance and prevent pressure-induced damage by maintaining high compliance and low contact resistance, ensuring efficient heat dissipation from electronic components.

Implementation Method 1

The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)