Thermal Interface Materials with Low Secant Modulus
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Solution Overview
Problem
There is a need for thermal interface materials that offer low thermal resistance and high thermal conductivity while requiring relatively low pressure application and having a low secant modulus of elasticity to prevent damage to delicate components during deflection.
Innovation Solution
The development of thermal interface materials with a unique combination of high thermal conductivity and low secant modulus of elasticity, achieved by using a base resin loaded with thermally-conductive fillers such as alumina and aluminum, which allows for efficient heat transfer and compliance to achieve a thin bondline with minimal pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials with high thermal conductivity are used, then heat transfer efficiency is improved, but the material becomes more rigid and requires higher pressure application
Solution Approach 1:
The patent modifies the material parameters by controlling the filler particle size distribution, filler loading concentration, and base resin properties to achieve an optimal balance between thermal conductivity and secant modulus of elasticity, allowing high thermal conductivity without excessive rigidity
Solution Approach 2:
The patent uses composite materials consisting of thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed in a polymer base resin, creating a material that combines the high thermal conductivity of inorganic fillers with the flexibility and low secant modulus of the polymer matrix
2Object-affected harmful factors
If pressure application is reduced to prevent damage to delicate components, then component safety is improved, but thermal contact resistance increases
Solution Approach 1:
The patent changes the mechanical parameters of the thermal interface material by reducing the secant modulus of elasticity through filler particle size optimization and base resin selection, enabling the material to conform to non-flat surfaces and maintain low thermal contact resistance at lower compression pressures
Solution Approach 2:
The patent utilizes a filler particle packing structure that creates interparticle voids filled with base resin, allowing the material to be more compliant and conform better to mating surfaces under low pressure, thereby maintaining good thermal contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These materials enable effective heat transfer with low thermal resistance and prevent pressure buildup, ensuring the safety and efficiency of electrical components by maintaining low contact resistances and conforming to non-flat surfaces.
Implementation Method 1
The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency as compared to having the gap filled with air, which is a relatively poor thermal conductor
Data Source
AI summary
Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.