Thermal Interface Material with Phase-Change Particles
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Solution Overview
Problem
Conventional thermal interface materials have a low heat conduction coefficient due to the small surface area of particles contacting electronic components and heat sinks, which is insufficient for contemporary applications with increasing heat dissipation requirements.
Innovation Solution
A thermal interface material with a base and thermally conductive particles that change size and conductivity upon temperature, allowing for increased surface contact and improved heat transfer by melting and agglomerating to form larger particles with higher conductivity, and optionally incorporating additional high-conductivity particles for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If particles are diffused in the base material to create thermal interface material, then the material provides thermal conduction, but the particle surface area contacting electronic component and heat sink is very small resulting in low heat conduction coefficient
Solution Approach 1:
The patent utilizes the phase transition of low-melting-point particles (from solid to liquid and back to solid) to dynamically change the thermal interface material's structure. When heated by the electronic component, the low-melting-point particles melt and flow to fill voids and increase contact area with both the component and heat sink. Upon cooling, they solidify to maintain this improved contact configuration, thereby significantly enhancing the heat conduction coefficient without requiring larger static particle surface area.
Solution Approach 2:
The patent creates a dynamic thermal interface material where particles can change their physical state and spatial distribution in response to temperature changes. The low-melting-point particles transition from a fixed dispersed state at low temperature to a flowing liquid state at operating temperature, allowing them to dynamically adapt and maximize contact area with mating surfaces, thus resolving the contradiction between particle size and contact surface area.
2Productivity
If conventional thermal interface material with small particles is used, then the material structure is simple, but the heat dissipation capability is insufficient for contemporary applications
Solution Approach 1:
The patent employs a composite material system consisting of a base material (such as silicone rubber or epoxy resin) combined with multiple types of particles: high thermal conductivity particles (silver, aluminum oxide, boron nitride) and low-melting-point particles (bismuth-based alloy, indium, or gallium). This composite structure leverages the high thermal conductivity of metal particles while utilizing the phase-change properties of low-melting-point particles to improve contact, achieving superior heat dissipation performance without excessive structural complexity.
Solution Approach 2:
The patent changes the physical state parameter of specific particles within the thermal interface material by exploiting melting point differences. The low-melting-point particles (melting point below electronic component operating temperature) undergo phase transition from solid to liquid when heated, enabling them to flow and fill gaps, then solidify upon cooling to maintain enhanced thermal contact, thereby significantly improving heat dissipation rate through controlled parameter change rather than increasing overall material complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material effectively reduces thermal resistance and enhances heat transfer rates by increasing the surface area of conductive particles, allowing for efficient heat dissipation from electronic components to heat sinks, even at elevated temperatures.
Implementation Method 1
the first thermally conductive particles melt and agglomerate when the electronic component operates at a temperature above the first melting temperature
Implementation Method 2
the first thermally conductive particles melt and agglomerate when the electronic component operates at a temperature above the first melting temperature
Implementation Method 3
A thermal interface material with a base and thermally conductive particles that change size and conductivity upon temperature, allowing for increased surface contact and improved heat transfer
Data Source
AI summary
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.