Thermal Interface Material Segmentation for Semiconductor Heat Dissipation
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Solution Overview
Problem
In compact electronic devices, the thermal management of semiconductor packages is challenging due to the limited thermal dissipation capabilities of small form-factor designs, leading to increased thermal resistance and potential BGA solder joint failures under traditional thermal solution loads.
Innovation Solution
A thermal solution is implemented where a thermally conductive member is positioned between the semiconductor package and a thermal member, with a thermal interface material (TIM) applied to create a higher pressure region over high thermal output areas and a lower pressure region over lower thermal output areas, optimizing the force distribution and enhancing thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional thermal solution is applied to dissipate heat from semiconductor packages, then thermal dissipation capability is improved, but the applied force on the semiconductor package and printed circuit board increases, leading to potential BGA joint failures
Solution Approach 1:
The thermal interface material is divided into multiple regions with different thicknesses: a first region with greater thickness over low thermal output areas and a second region with lesser thickness over high thermal output areas. This segmentation allows different portions of the semiconductor package to experience different pressure levels, optimizing both thermal dissipation and mechanical reliability.
Solution Approach 2:
The thermal interface material exhibits spatially varying properties through its non-uniform thickness distribution. Areas with high thermal output have thinner TIM for better thermal contact and heat transfer, while areas with low thermal output have thicker TIM to reduce overall force application. This local quality variation resolves the contradiction between thermal performance and mechanical stress.
2Area of moving object
If the footprint of semiconductor packages is reduced to meet compact device requirements, then device compactness is improved, but thermal dissipation capability deteriorates due to limited surface area
Solution Approach 1:
By creating regions of different TIM thickness corresponding to different thermal output areas, the patent maximizes thermal dissipation efficiency within the limited footprint. High thermal output areas receive enhanced thermal contact through thinner TIM, compensating for the overall reduced surface area available for heat dissipation.
3Ease of manufacture
If uniform pressure is applied across the entire semiconductor package surface, then manufacturing simplicity is maintained, but thermal performance is suboptimal because high thermal output areas require higher pressure for effective heat transfer
Solution Approach 1:
The thermal interface material is designed with spatially varying thickness to create localized pressure differences. This allows high thermal output areas to experience higher pressure (through thinner TIM) for reduced thermal resistance, while low thermal output areas experience lower pressure. The variable geometry is manufactured as an integrated structure, balancing manufacturing feasibility with optimized thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the applied force on the semiconductor package and printed circuit board, preventing BGA joint failures while maintaining or improving thermal performance by creating a localized high-pressure region for enhanced thermal energy transfer.
Implementation Method 1
a thermal interface material (TIM) disposed between the semiconductor package and the thermal member... enhancing the flow of thermal energy from the semiconductor package to the thermal member
Data Source
AI summary
Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.