Thermal Interface Materials with Low Secant Modulus
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Solution Overview
Problem
There is a need for thermal interface materials that offer low thermal resistance and high thermal conductivity while requiring relatively low pressure application and having a low secant modulus of elasticity to prevent damage to delicate components during deflection.
Innovation Solution
The development of thermal interface materials with a combination of high thermal conductivity (greater than 4 W/mK) and low secant modulus of elasticity (no more than 620 kPa at 50% strain), comprising a base resin loaded with thermally-conductive fillers such as alumina and aluminum, which allows for efficient heat transfer with minimal pressure and compliance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials with high thermal conductivity are used, then heat transfer efficiency is improved, but the material becomes more rigid and requires higher pressure for proper contact
Solution Approach 1:
The patent modifies the material parameters by controlling the filler particle size distribution, filler loading concentration, and base polymer properties to achieve an optimal balance between thermal conductivity and secant modulus of elasticity, allowing high thermal conductivity without excessive rigidity
Solution Approach 2:
The patent uses composite materials consisting of thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed in a polymer matrix, where the filler particles enhance thermal conductivity while the polymer matrix maintains flexibility and low secant modulus
2Temperature
If high filler loading is used to increase thermal conductivity, then thermal performance is improved, but the material becomes harder to process and apply
Solution Approach 1:
The patent employs a bimodal or multimodal filler particle size distribution where fine particles fill the voids between larger particles, improving thermal conductivity and packing density without requiring excessive filler loading that would compromise processability
Solution Approach 2:
The patent optimizes the filler loading concentration within a specific range (typically 60-85 wt%) and controls the particle size distribution to maintain both high thermal conductivity and adequate processability for manufacturing and application
3Ease of operation
If low secant modulus of elasticity is used to reduce pressure requirements, then ease of application is improved, but thermal conductivity may be reduced
Solution Approach 1:
The patent uses composite materials where thermally conductive filler particles are dispersed in a polymer matrix with low secant modulus, allowing the composite to maintain flexibility and compliance while achieving high thermal conductivity through the filler network
Solution Approach 2:
The patent carefully selects and optimizes the base polymer material and its crosslinking density to achieve low secant modulus of elasticity (typically below 1 MPa) while incorporating sufficient thermally conductive filler to maintain high thermal conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These materials enable effective heat transfer with low thermal resistance and prevent excess pressure buildup, ensuring the reliability and longevity of electrical components by maintaining optimal operating temperatures.
Implementation Method 1
The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency
Data Source
AI summary
Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.