Thermal Interface Material with Phase Change Void Filler
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Solution Overview
Problem
Conventional thermal interface materials, such as gap fillers, fail to effectively conform to non-uniform thermal transfer surfaces, leading to high surface contact resistance and reduced heat conduction efficiency due to air gaps and limited interfacial contact properties.
Innovation Solution
Incorporating contact resistance reducing materials, like phase change materials and greases, into thermal interface materials to fill interstitial voids and reduce surface contact resistance by conforming to thermal transfer surfaces, thereby enhancing heat conduction between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal interface materials with high thermal conductivities are used, then thermal conduction capability is improved, but surface contact resistance increases due to inability to fill interstitial voids
Solution Approach 1:
The patent combines a gap filler material (providing high thermal conductivity) with a phase change material (providing void-filling capability) to create a composite thermal interface material. This composite structure allows the material to simultaneously achieve high thermal conduction capability while effectively filling interstitial voids between non-uniform surfaces, thereby reducing surface contact resistance.
Solution Approach 2:
The patent utilizes the phase change material's ability to change physical state (from solid to liquid-like) at operating temperatures to dynamically adapt the material's flow properties. This parameter change enables the material to flow into and fill voids at the interface, improving contact without compromising the overall structural integrity or thermal conduction capability provided by the gap filler matrix.
2Shape
If gap fillers are used to fill gaps between surfaces, then gap filling capability is improved, but surface contact resistance remains high due to poor conformation to non-uniform surfaces
Solution Approach 1:
The patent applies the phase change material specifically at the interface regions where contact with mating surfaces occurs, allowing local adaptation to surface irregularities. The gap filler provides bulk gap filling with structural support, while the phase change material locally conforms to surface variations at contact points, achieving both gap filling and low contact resistance.
Solution Approach 2:
The patent introduces dynamic adaptability through the phase change material, which can change its physical state in response to temperature changes during operation. This dynamic property enables the material to flow and conform to surface irregularities when needed, then maintain structural integrity when not, allowing the gap filler to effectively adapt to varying interface conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of these materials significantly reduces thermal impedance and improves thermal transfer efficiency by minimizing air gaps and increasing effective surface area contact, leading to lower thermal resistance and improved heat conduction.
Implementation Method 1
The second material operates to fill interstitial voids of surfaces of the components when the thermal interface material is used with the electronic device
Implementation Method 2
transferring heat between heat generating components and heat removing components of the electronic devices
Data Source
AI summary
A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.