Thermal Interface Sandwich for Power Module Heat Dissipation
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Solution Overview
Problem
Electrical devices generate significant heat, posing safety concerns and degrading performance, while also requiring effective insulation to prevent unwanted current flow and protection from foreign contaminants.
Innovation Solution
A sealed power module with a thermally conductive and electrically insulating cover that encloses heat-generating components, using a heat sink and gaskets to manage heat and maintain insulation, along with a gantry assembly to secure transistors against a thermal interface sandwich for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is used to manage heat from electrical components, then heat dissipation is improved, but electrical insulation may be compromised due to conductive materials
Solution Approach 1:
The patent introduces a thermal interface sandwich comprising multiple layers including thermally conductive and electrically insulating materials positioned between the transistor and heat sink. This intermediary structure enables heat transfer while maintaining electrical insulation, resolving the contradiction between heat dissipation and electrical insulation requirements.
Solution Approach 2:
The thermal interface sandwich utilizes composite material construction with multiple distinct layers serving different functions: some layers provide thermal conductivity while others provide electrical insulation. This composite approach allows simultaneous achievement of heat dissipation and electrical insulation that cannot be achieved with single materials.
2Object-affected harmful factors
If electrical components are enclosed to protect from contaminants, then protection is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent segments the enclosure system into separate functional zones: a sealed housing providing contaminant protection, and a dedicated thermal interface sandwich pathway enabling heat dissipation. The gantry assembly creates a structured interface region that allows thermal management without compromising the sealed environment, resolving the contradiction between enclosure protection and heat dissipation.
3Temperature
If transistors are pressed against a heat sink for heat transfer, then heat dissipation is improved, but electrical current may flow through the contact path
Solution Approach 1:
The thermal interface sandwich acts as an intermediary layer between the transistor and heat sink, providing a controlled contact path that facilitates heat transfer while blocking electrical current. The multi-layer construction includes electrically insulating materials that prevent unwanted current flow while maintaining thermal conductivity through the interface.
Solution Approach 2:
The patent applies different material properties at different locations within the thermal interface sandwich. Certain layers are optimized for thermal conductivity while adjacent layers provide electrical insulation. This local differentiation of material qualities enables simultaneous heat transfer and electrical isolation at the transistor-heat sink interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat within the electrical device, maintaining electrical insulation and preventing unwanted current flow while providing a high ingress protection rating, ensuring the safety and performance of sensitive components.
Implementation Method 1
A thermal interface sandwich for use with an electrical component that generates heat and, optionally, includes an active voltage is disclosed. The thermal interface sandwich includes a thermally conductive solid
Implementation Method 2
A thermal interface material is applied to the top surface of the thermally conductive solid and a second thermal interface material is applied to a bottom surface of the thermally conductive solid
Implementation Method 3
The thermal interface sandwich is configured to be thermally conductive and electrically insulating
Data Source
AI summary
A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.