Thermal Interface Assembly with Segmented Sheets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermal interface assemblies face challenges in achieving flexibility while maintaining high thermal conductivity, as stiff materials can cause damage to components and filler additions compromise heat transfer efficiency.
Innovation Solution
A thermal interface assembly comprising a resilient pad with discrete thermal sheets, where each sheet has interconnected heat transfer portions attached to the pad's surfaces, allowing for efficient heat transfer along both in-plane and through-plane paths, reducing compressive forces and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If stiff thermal interface material is used, then thermal conductivity is improved, but high compressive forces are applied causing damage to components
Solution Approach 1:
The thermal interface material is segmented into a modular assembly consisting of a resilient pad and multiple discrete thermal sheets. This segmentation allows the resilient pad to provide mechanical compliance and reduce compressive forces, while the thermal sheets provide high thermal conductivity pathways, resolving the contradiction between stiffness and flexibility.
Solution Approach 2:
The invention uses a composite structure combining a resilient pad material with discrete thermal sheets. This composite approach allows the assembly to exhibit both the flexibility of the resilient pad and the high thermal conductivity of the thermal sheets, eliminating the need to choose between stiffness and compliance.
2Ease of operation
If filler material is added to decrease stiffness, then flexibility is improved, but thermal conductivity decreases
Solution Approach 1:
Instead of adding filler material to the resilient pad, the invention segments the thermal interface into separate functional components: the resilient pad for flexibility and discrete thermal sheets for high thermal conductivity. This avoids the trade-off inherent in adding fillers to compliant materials.
Solution Approach 2:
The invention merges the advantages of two different material types by combining a resilient pad with discrete thermal sheets in a single assembly. The thermal sheets are positioned to bridge the heat generating component and heat dissipating component, providing high thermal conductivity without compromising the flexibility provided by the resilient pad.
3Ease of operation
If thermal sheet is attached to resilient pad, then flexibility is maintained, but in-plane heat transfer path length increases reducing heat transfer efficiency
Solution Approach 1:
The thermal sheets are configured to extend about the edges of the resilient pad, creating a three-dimensional heat transfer pathway that utilizes both in-plane and through-plane conduction. This dimensional approach shortens the effective in-plane heat transfer path by providing direct thermal pathways through the assembly structure.
Solution Approach 2:
The thermal sheets are shaped to conform to and extend about the curved edges of the resilient pad, optimizing the heat transfer pathway geometry. This curvature allows the thermal sheets to maintain intimate thermal contact while providing direct heat transfer routes that minimize path length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly provides improved flexibility and increased thermal conductivity, reducing the in-plane path length for heat transfer and minimizing component damage, while maintaining effective heat dissipation from heat generating to heat dissipating components.
Implementation Method 1
Each of the plurality of discrete thermal sheets is configured to transfer heat from the heat generating component to the heat dissipating component along an in-plane path
Implementation Method 2
a resilient pad having first and second opposite surfaces
Data Source
AI summary
A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.