Thermal Interface Material Assembly for Sliding Optical Modules
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Solution Overview
Problem
Conventional thermal interface materials lack sufficient abrasion resistance, leading to decreased thermal performance due to damage from repeated sliding motions, such as in the plugging and unplugging of optical modules, which results in higher failure rates and reduced reliability of optical box modules.
Innovation Solution
A thermal interface material assembly featuring a substrate with an antifriction layer, such as polytetrafluoroethylene (PTFE) or molybdenum disulfide (MoS2), sandwiched between the antifriction layer and a thermal interface material, which is adhesively attached to a heatsink, allowing for sliding contact and reducing frictional resistance while maintaining thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface material is used, then thermal conductivity is achieved, but abrasion resistance is insufficient leading to performance degradation after repeated sliding
Solution Approach 1:
The patent applies composite materials by combining a substrate layer with an antifriction layer on its sliding surface. The substrate provides thermal conduction functionality, while the antifriction layer (made of materials like PTFE, MoS2, or graphite) provides wear resistance. This composite structure resolves the contradiction by integrating both thermal conductivity and abrasion resistance into a single integrated component.
2Loss of energy
If direct surface contact between electrical component and heatsink is used, then thermal transfer efficiency is maximized, but friction and wear increase during sliding operations
Solution Approach 1:
The patent introduces an antifriction layer as an intermediary substance between the electrical component and the heatsink. This intermediate layer maintains intimate thermal contact for efficient heat transfer while simultaneously reducing friction and wear during sliding operations. The antifriction layer acts as a mediator that reconciles the conflicting requirements of thermal efficiency and mechanical durability.
3Reliability
If thermal interface material is used to fill gaps, then thermal transfer efficiency increases, but the material suffers damage from repeated sliding motions
Solution Approach 1:
The patent creates a composite thermal interface material consisting of a substrate layer bonded to an antifriction layer. The substrate layer maintains thermal contact and fills gaps effectively, while the antifriction layer protects the entire assembly from wear during repeated sliding. This composite approach extends the service life of the thermal interface material while preserving its thermal transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and maintains thermal performance even after multiple sliding cycles, achieving a temperature reduction of up to 5°C and withstanding 500 cycles of plugging and unplugging, thereby enhancing reliability and durability.
Implementation Method 1
The thermal interface material may be used to fill the gap between thermal transfer surfaces, in order to increase thermal transfer efficiency
Implementation Method 2
An antifriction layer is along the first surface of the substrate... configured to slide along in contact with a first surface of a first component
Data Source
AI summary
Exemplary embodiments are disclosed of thermal interface solutions for sliding surfaces. In an exemplary embodiment, a thermal interface material assembly includes a substrate having opposite first and second surfaces. An antifriction layer is along the first surface of the substrate. A thermal interface material is along the second surface of the substrate, such that the substrate is between the antifriction layer and the thermal interface material. The antifriction layer is configured to slide along in contact with a first surface of a first component when the thermal interface material assembly is along a second surface of a second component and when the first and second surfaces are slidably moved relative to each other.