Thermal Interface Tape for Semiconductor Chip Heat Dissipation
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Solution Overview
Problem
Stacked semiconductor chip devices face challenges in providing adequate electrical and thermal interfaces, managing heat dissipation, and identifying defective chips early in the processing phase to avoid unnecessary processing steps.
Innovation Solution
A thermal interface tape is applied to semiconductor chips, providing a transient thermal pathway for heat dissipation and enabling electrical testing at high powers and frequencies, allowing for early identification of defective chips and efficient stacking processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electrical testing is performed on semiconductor chips at high power levels, then testing accuracy is improved, but thermal management becomes difficult and chips may enter thermal runaway
Solution Approach 1:
A thermal interface material is applied to the backside of the semiconductor chip before electrical testing. This preliminary thermal management preparation enables the chip to dissipate heat effectively during high-power electrical testing, allowing accurate testing without risking thermal runaway.
2Adaptability or versatility
If multiple semiconductor chips are stacked and processed in sequence, then device functionality is improved, but processing time increases and defective chips are identified late
Solution Approach 1:
The thermal interface material is applied to multiple semiconductor chips simultaneously on the wafer level before singulation and stacking. This preliminary application enables subsequent parallel processing and early electrical testing of individual chips, allowing defective chips to be identified before stacking, thereby reducing overall processing time and preventing waste of subsequent processing steps.
3Manufacturing precision
If semiconductor chips are processed in a linear fashion through multiple steps, then manufacturing precision is maintained, but defective parts undergo needless additional processing
Solution Approach 1:
Electrical testing is performed on semiconductor chips at an early stage in the manufacturing process, after only the essential fabrication steps have been completed. By using the thermal interface material to enable high-power testing early, defective chips can be identified and removed before subsequent processing steps such as stacking and packaging, thereby preventing material waste while maintaining manufacturing precision for good chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal issues during testing, reduces waste by identifying defective chips early, and facilitates efficient stacking by providing a reliable thermal interface for semiconductor chips, thereby optimizing processing efficiency and reducing costs.
Implementation Method 1
A thermal interface tape is applied to semiconductor chips, providing a transient thermal pathway for heat dissipation
Data Source
AI summary
A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.