Thermal Interface Wired Network for IC Package Warpage
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Solution Overview
Problem
In integrated circuit (IC) packages, uneven thermal interfaces between electronic components and a heat spreader lid due to differences in height or position can lead to uneven heat conduction, causing package warpage, stress on connections, and reduced performance.
Innovation Solution
A thermal interface system comprising a wired network of a first thermal interface material (TIM) surrounded by a second TIM, where the wired network provides enhanced heat conduction and physical support, allowing for consistent heat transfer across varying interface heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader lid is placed over electronic components to disperse heat, then thermal performance is improved, but package warpage and mechanical stress increase due to uneven thermal interfaces
Solution Approach 1:
The patent applies local quality by providing different support heights at different locations of the package cavity. Adjustable support members are positioned at specific locations where electronic components are mounted, allowing localized compensation for interface height variations between the heat spreader lid and components. This local adjustment ensures uniform thermal contact pressure at each component location while maintaining overall package stability.
Solution Approach 2:
The patent employs parameter changes by making the support members adjustable in height. The support members can be modified to different heights to compensate for variations in electronic component heights, ensuring that the heat spreader lid maintains consistent contact pressure with each component. This parameter adjustment resolves the contradiction by allowing thermal performance optimization without inducing package warpage.
2Loss of energy
If thermal interface material is used between electronic components and heat spreader lid, then heat conduction is improved, but uneven heat conduction occurs due to varying interface heights
Solution Approach 1:
The patent introduces adjustable support members as intermediary elements between the package substrate and the heat spreader lid. These support members act as mediators that compensate for height variations in electronic components, ensuring that the thermal interface material maintains uniform compression and contact across all components. This intermediary structure enables consistent heat conduction despite variations in component heights or positions.
3Adaptability or versatility
If electronic components with different heights or positions are mounted on the package, then design flexibility is improved, but thermal interface consistency deteriorates
Solution Approach 1:
The patent applies dynamics by making the support members adjustable rather than fixed. The adjustable support members can be modified to different heights to accommodate various electronic component configurations. This dynamic adjustment capability allows the package to adapt to different component heights and positions while maintaining consistent thermal interface quality, thereby resolving the contradiction between design flexibility and interface consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent heat conduction and reduced stress across IC packages with varying interface heights, improving thermal performance and mechanical stability.
Implementation Method 1
A thermal interface system comprising a wired network of a first thermal interface material (TIM) surrounded by a second TIM, where the wired network provides enhanced heat conduction
Data Source
AI summary
A thermal interface may include a wired network made of a first TIM, and a second TIM surrounding the wired network. A heat spreader lid may include a wired network attached to an inner surface of the heat spreader lid. An IC package may include a heat spreader lid placed over a first electronic component and a second electronic component. A first thermal interface may be formed between the first electronic component and the inner surface of the heat spreader lid, and a second thermal interface may be formed between the second electronic component and the inner surface of the heat spreader lid. The first thermal interface may include a wired network of a first TIM surrounded by a second TIM, while the second thermal interface may include the second TIM, without a wired network of the first TIM. Other embodiments may be described and/or claimed.