Active Thermal Interposer for Multi-Zone IC Test Temperature Control
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Solution Overview
Problem
Existing thermal control systems for integrated circuit testing are limited in their ability to control different portions of a device under test to various temperatures, especially at different heights, due to constraints in environmental chambers and conventional control methods.
Innovation Solution
The implementation of a multi-input multi-zone thermal control system that uses an active thermal interposer device with customizable zones, capable of being selectively heated or cooled, in conjunction with a thermal management head and a test processor, to control the temperature of different portions of a device under test.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an environmental chamber is used to heat and cool the integrated circuit under test, then the device can be subjected to environmental stress testing, but the testing rate is limited due to the large volume of air and mass of mounting structures required within the chamber
Solution Approach 1:
The patent divides the thermal control system into multiple independent heating zones on the probe card, each capable of being controlled separately. This segmentation allows different regions of the device under test to be subjected to different thermal conditions simultaneously, enabling faster and more flexible testing compared to a single environmental chamber approach.
Solution Approach 2:
The patent implements local thermal control by providing multiple heating zones with independent temperature control on the probe card. Each zone can be tailored to specific testing requirements for different regions of the device, allowing precise local thermal stress application without affecting the entire device uniformly, thus improving testing efficiency and rate.
2Device complexity
If a single temperature control system is used for the entire device under test, then the system is simpler to implement, but it cannot control different portions of the device to different temperatures at different heights
Solution Approach 1:
The probe card is divided into multiple heating zones, each with independent temperature control capability. This segmentation enables the system to apply different temperatures to different regions of the device under test, achieving multi-zone thermal control while maintaining a relatively simple overall system architecture.
Solution Approach 2:
The probe card serves multiple functions: it provides electrical connections for testing and simultaneously acts as a thermal control device with multiple independently controllable heating zones. This multi-functionality allows the same structure to perform both electrical and thermal management tasks, reducing the need for separate complex thermal control systems.
3Ease of manufacture
If conventional thermal control methods are used, then the system is easier to implement, but the accuracy and precision of thermal management is insufficient for advanced device testing requirements
Solution Approach 1:
The patent incorporates temperature sensors in each heating zone that provide real-time temperature feedback to the control system. This feedback mechanism enables precise temperature control and monitoring, allowing the system to maintain accurate thermal conditions in each zone independently, thereby improving thermal management precision while keeping the control logic manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise thermal management of integrated circuit devices under test, allowing for independent temperature control of multiple zones at different heights, thereby enhancing the accuracy and efficiency of thermal testing.
Implementation Method 1
disposing an active thermal interposer device adjacent to a cold plate of said thermal management head
Implementation Method 2
said active thermal interposer device comprises a plurality of zones, each zone of said plurality of zones operable to be selectively heated
Data Source
AI summary
Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a die and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.