Thermal Interposer Heating Zones With Isolation for Faster IC Testing
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Solution Overview
Problem
Existing integrated circuit testing methods face limitations due to environmental test chambers that degrade testing accuracy and rate, as they are hindered by the thermal mass and air volumes of test interfaces, requiring complex and expensive mechanisms for DUT insertion and removal.
Innovation Solution
An active thermal interposer device with thermal isolation structures, including trenches and heating zones, allows for independent temperature control of different device regions and is compatible with existing testing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If environmental test chambers are used to heat and cool integrated circuits, then thermal control capability is provided, but testing rate is limited due to substantial air volumes and thermal mass
Solution Approach 1:
The test interface is divided into multiple independently controllable heating zones (first heating zone, second heating zone, third heating zone) that can be controlled separately. This segmentation allows different regions to be heated or cooled independently, enabling rapid temperature changes without being constrained by the thermal mass of the entire test interface, thus resolving the contradiction between thermal control capability and testing rate.
Solution Approach 2:
Different regions of the test interface are assigned different thermal control characteristics. The first heating zone is thermally coupled to the DUT for precise local temperature control, while the second and third heating zones provide environmental control for other test components. This local quality approach allows rapid temperature changes in specific areas without affecting the entire test chamber, thereby improving testing rate while maintaining thermal control capability.
2Temperature
If environmental test chambers are used for integrated circuit testing, then thermal control is achieved, but testing accuracy is degraded due to environmental limits of test interface circuits
Solution Approach 1:
A thermal interface device is introduced as an intermediary between the environmental test chamber and the DUT. This device includes heating zones that can be independently controlled to compensate for environmental temperature variations, providing a stable thermal environment for the DUT regardless of chamber conditions. This intermediary approach resolves the contradiction by maintaining testing accuracy through precise local thermal control while allowing the chamber to provide overall environmental control.
3Temperature
If complex mechanisms are used for DUT insertion and removal in test chambers, then thermal control is maintained, but device complexity and cost increase
Solution Approach 1:
The test interface is designed with pre-configured heating zones and thermal coupling structures that are ready before DUT insertion. The first heating zone is thermally coupled to the DUT mounting structure, allowing immediate thermal control upon insertion without requiring complex active mechanisms. This preliminary action approach maintains thermal control while reducing device complexity by eliminating the need for complex insertion/removal mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and precise thermal control of integrated circuits during testing, enhancing testing rates and accuracy while being compatible with standard equipment.
Implementation Method 1
a plurality of heating structures operable to selectively heat and maintain temperatures of the plurality of heating zones
Implementation Method 2
a plurality of thermal resistance structures operable to resist thermal conductance between the plurality of heating zones
Data Source
AI summary
Active thermal interposer (ATI) device for use in testing a device under test (DUT). The ATI device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate and wherein the second surface is operable to be disposed in proximity to the DUT. The body layer further includes a heating layer defining a plurality of heating zones across the second surface. The plurality of heating zones are operable to be controlled during the testing to selectively heat and maintain respective temperatures thereof. The heating layer further includes a plurality of heating structures operable to selectively heat and maintain temperatures of the plurality of heating zones, and a plurality of thermal resistance structures operable to resist thermal conductance between the plurality of heating zones.