Thermal Uniform Interposer for Scorch-Free Solder Bump Heating
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Solution Overview
Problem
Conventional semiconductor packaging methods face issues of warpage and poor reliability due to thermal stress and overheating during laser-assisted bonding, leading to scorching of packaging layers and solder non-wetting.
Innovation Solution
The use of a thermal uniform interposer made of semiconductor material with a hollow part to expose the electronic element, allowing the laser beam to irradiate the element and carrier structure without directly hitting the packaging layer, converting laser energy into radiant heat to uniformly heat solder bumps through air transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a laser beam irradiates the packaging layer during the LAB process, then the solder bumps can be heated for bonding, but the packaging layer is scorched due to overheating and the solder bumps receive insufficient heat energy
Solution Approach 1:
The patent segments the laser irradiation process by introducing a hollow cylindrical structure that divides the laser beam path into two distinct zones: an inner hollow region that allows direct laser transmission to the solder bumps, and an outer region that blocks laser exposure to the packaging layer. This spatial segmentation resolves the contradiction by directing heat energy precisely where needed while protecting vulnerable areas from overheating
Solution Approach 2:
The hollow cylindrical structure acts as an intermediary element between the laser beam and the packaged components. It selectively transmits laser energy to the solder bumps through its hollow core while preventing direct laser exposure to the packaging layer, thereby mediating the heat distribution to achieve uniform solder heating without packaging layer scorching
2Temperature
If the laser beam irradiates the packaging layer, then the solder bumps can be heated, but the heat energy is blocked by the packaging layer causing insufficient heating and solder non-wetting
Solution Approach 1:
Instead of irradiating the packaging layer from above (conventional approach), the patent inverts the heating approach by using the hollow cylindrical structure to direct laser energy through its hollow core directly to the solder bumps from the side, bypassing the packaging layer entirely. This inverted heating path ensures sufficient heat energy reaches the solder bumps for reliable wetting and bonding
3Loss of time
If the laser beam is used for rapid heating of solder bumps, then the bonding time is reduced, but the packaging layer absorbs excessive heat causing scorching
Solution Approach 1:
The hollow cylindrical structure creates local quality differentiation in heat distribution: the inner hollow region provides concentrated laser energy for rapid solder bump heating, while the outer region structure blocks excessive heat from reaching the packaging layer. This localized heat control enables rapid bonding without packaging layer scorching
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents packaging layer scorching and ensures uniform heating of solder bumps, addressing solder non-wetting issues and improving reliability.
Implementation Method 1
irradiating the electronic element by a laser beam through a hollow part of the thermal uniform interposer to transmit the heat energy of the laser beam to the plurality of solder bumps
Implementation Method 2
the thermal uniform interposer absorbs the energy of the laser beam and converts it into radiative heat, which is transmitted to the packaging layer below via the air to uniformly heat the solder bumps
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic element and a packaging layer encapsulating around the electronic element are disposed on a carrier structure, and the carrier structure is connected to a substrate through a plurality of solder bumps, and the electronic element is exposed by a thermal uniform interposer covering the packaging layer to irradiate the electronic element and the thermal uniform interposer with a laser beam, so that the energy of the laser beam absorbed by the thermal uniform interposer is converted into radiative heat, which is transmitted to the packaging layer below via the air, so that the solder bumps can be uniformly heated to avoid the problem of non-wetting of the solder from occurrence.