Thermal Interposer Isolation Structure for Multi-Zone IC Testing
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Solution Overview
Problem
Existing integrated circuit testing methods face limitations due to environmental test chambers that degrade testing accuracy and rate, as they are hindered by the thermal mass and air volumes of test interfaces, requiring complex and expensive mechanisms for DUT insertion and removal.
Innovation Solution
An active thermal interposer device with thermal isolation zones and resistance structures allows independent temperature control of different DUT regions, using a stand-alone design compatible with existing systems to enhance thermal management during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional environmental test chambers are used for thermal control, then thermal control capability is provided, but testing rate is limited due to substantial air volumes and mass of mounting structures
Solution Approach 1:
The test chamber is divided into multiple independently controllable thermal zones (first thermal zone, second thermal zone, etc.), each capable of applying thermal energy to different regions of the device under test. This segmentation allows simultaneous thermal control of multiple regions at different temperatures, eliminating the need to wait for uniform temperature changes across the entire chamber and thereby increasing testing rate.
Solution Approach 2:
Each thermal zone is equipped with dedicated heating and cooling elements that can independently control the temperature of specific regions of the device under test. This local quality approach enables precise thermal management of different components at different temperatures, reducing the overall thermal control time compared to uniform chamber heating/cooling.
2Measurement precision
If traditional environmental test chambers are used, then thermal control is provided, but accuracy is degraded due to environmental limits of test interface circuits and devices
Solution Approach 1:
The patent introduces thermal interface devices as intermediaries between the thermal zones and the device under test. These interface devices are specifically designed to minimize environmental interference and provide precise thermal coupling, thereby improving measurement precision while reducing the harmful environmental limits of traditional test interfaces.
Solution Approach 2:
The patent replaces traditional mechanical environmental chambers with an active thermal control system using electrical heating and cooling elements. This substitution allows for more precise and rapid thermal control without the environmental limitations inherent in traditional mechanical chamber systems.
3Productivity
If complex mechanisms are used for inserting and removing DUTs from test chambers, then testing capability is provided, but device complexity increases and testing rate decreases
Solution Approach 1:
The test chamber is segmented into multiple independent thermal zones that can be accessed and controlled separately. This segmentation allows for simpler, more modular insertion and removal mechanisms for different device regions, reducing overall device complexity while maintaining high testing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and precise thermal control of integrated circuits, improving testing efficiency and compatibility with various DUT configurations, while maintaining thermal isolation and reducing mechanical complexity.
Implementation Method 1
a thermal resistance structure, disposed in the formation and located between the first thermal zone and the second thermal zone, the thermal resistance structure configured to limit conductance of thermal energy therebetween
Implementation Method 2
The first thermal zone is configured to apply thermal energy to a first thermal region of the DUT
Implementation Method 3
The second thermal zone is configured to apply thermal energy to a second thermal region of the DUT
Data Source
AI summary
An active thermal interposer (ATI) device for use in testing integrated circuit device under test (DUT) having thermal isolation structures. The ATI device includes a formation having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the formation, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the formation is disposed adjacent to an interface surface of the DUT during testing of the DUT. The ATI device includes a plurality of thermal resistance structures configured to resist thermal conductance between the plurality of heating zones.