Thermal Isolation in Electronics Chassis Heatsink Fins

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Solution Overview

Problem

Existing electronic component chassis with heatsinks face challenges in managing components with different operating temperatures, as the bulk heatsink temperature can rise due to higher heat-emitting components, potentially overheating lower operating temperature components and affecting ambient temperature.

Innovation Solution

A thermally conductive electronics chassis with separate heat dissipators and a thermal isolator made of non-thermally conductive material, such as a polyamide elastomer, to prevent heat transfer between components with different temperature ratings, allowing for efficient heat dissipation from each component without overheating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple electronic components are mounted on a single heatsink, then the heatsink can dissipate heat from multiple components, but the bulk heatsink temperature rises due to higher heat-emitting components, potentially overheating lower operating temperature components

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidheatsink temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The heatsink is divided into multiple separate heat dissipators, each thermally isolated from the others. This segmentation allows each dissipator to independently manage the temperature of components mounted on it, preventing heat from high-power components from raising the temperature of the entire heatsink structure and affecting temperature-sensitive components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Thermal isolators are introduced as intermediary elements between separate heat dissipators. These isolators prevent thermal coupling between dissipators, allowing each to maintain its own temperature profile independently. This enables the system to accommodate components with different operating temperature requirements on the same chassis without thermal interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a single heatsink is used for multiple components, then the structure is simplified, but components with different operating temperature requirements cannot be accommodated simultaneously

Engineering Contradiction:

Improvechassis structureVSAvoidtemperature compatibility

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The unified heatsink structure is segmented into multiple independent heat dissipators, each capable of being optimized for specific temperature requirements. This segmentation maintains structural organization while enabling versatility in accommodating different component types with varying thermal characteristics on the same chassis.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heat dissipator can be designed with local quality characteristics tailored to the specific thermal requirements of the components it supports. This includes varying fin densities, materials, or geometries in different regions of the chassis, allowing simultaneous optimization for both high-temperature and low-temperature components within the overall system.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the simultaneous mounting of electronic components with varying operating temperatures on the same chassis without heat transfer, ensuring efficient heat dissipation and preventing overheating, while maintaining optimal operating conditions for both high and low heat generating components.

Implementation Method 1

a thermal isolator positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

Heatsinks also include features that increase surface area, such as fins, which provide greater heat loss, through convection, to the ambient environment

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

Heatsinks have been used to control the temperature of electronics. Heatsinks are generally comprised of thermally conductive material and are thermally connected to the electronic components

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9198328B1Thermal separation of electronic control chassis heatsink fins

Publication Date: 2015.11.24 HAMILTON SUNDSTRAND CORP

AI summary

An electronics chassis for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator in at least one of the walls having an external heat dissipator and a second heat dissipator in at least one of the walls having an external heat dissipator. There is a thermal isolator positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.