Thermal Isolation Riser Card for IC Chip Testing
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Solution Overview
Problem
Integrated circuits, particularly memory elements, face challenges in withstanding extreme temperatures due to heat dissipation issues in densely packed chips, which can lead to damage and require effective testing methods to ensure operational ruggedness.
Innovation Solution
The solution involves a system and method for testing the thermal conditioning of integrated circuits using a riser card with a heating element, a clamp with heating elements, or a liquid-based heating element that applies heat to the chip while providing thermal isolation from the motherboard, allowing sensors to monitor the chip's operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to test the chip, then thermal conditioning testing capability is improved, but risk of damaging motherboard components increases
Solution Approach 1:
The system divides the testing apparatus into separate functional modules: a riser card holder that isolates the chip under test from the motherboard, a heating element that applies heat only to the chip, and a cooling element that protects the motherboard. This segmentation allows thermal testing without damaging the motherboard by physically separating the heat source from components that should not be exposed to extreme temperatures.
Solution Approach 2:
The riser card acts as an intermediary between the chip and the motherboard, providing thermal isolation. The riser card holder positions the chip in a controlled environment where heat can be applied safely, while the cooling element serves as a protective intermediary that prevents heat transfer to the motherboard, thus enabling thermal testing without damaging other components.
2Power
If chips are densely packed to increase processing power, then computing capability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The testing system applies local quality control by providing targeted heating to only the specific chip being tested, while surrounding areas and the motherboard remain cool due to the cooling element. This localized thermal control allows accurate thermal conditioning testing without subjecting the entire system to extreme temperatures, enabling verification of heat tolerance in densely packed configurations.
3Reliability
If thermal testing is performed on chips, then operational ruggedness verification is improved, but test system complexity increases
Solution Approach 1:
The riser card holder is designed as a universal platform that can accommodate different chip types and configurations. The heating and cooling elements provide multi-functional thermal control, capable of both heating for thermal conditioning testing and cooling for protection. This universality reduces overall system complexity by using standardized components rather than custom-built specialized equipment for each testing scenario.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and safe testing of integrated circuits for thermal conditioning, allowing for certification of chips to operate at elevated temperatures and providing better test results with reduced risk of damaging other motherboard components.
Implementation Method 1
a heating element configured to be coupled to a power supply
Implementation Method 2
a liquid-based heating element that operates in a tube similar to a liquid-cooled computing device, but instead of cooling fluid passing through the tube, heated fluid passes through the tube
Data Source
AI summary
Systems and methods for testing the thermal conditioning of an integrated circuit (IC) are disclosed. In one aspect, a device is used to apply heat to a chip, and more particularly to a memory element, while providing thermal isolation to a motherboard with which circuits in the chip may be operating. Testing sensors may monitor operation of the circuits in the chip while the heat is applied to the chip. Having a device that is easily coupled to the chip under test, readily applies heat without damaging other components on a motherboard and allows testing of the chip under test will save time and provide better test results so that chips may be certified for operation at such elevated temperatures and/or provide a better product to customers.