Thermal Isolation of Heat-Generating Devices on Substrates
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Solution Overview
Problem
In densely packed electronic devices on a substrate, thermal coupling occurs due to inadequate heat dissipation, leading to performance degradation and reduced lifespan of heat-generating devices.
Innovation Solution
A substrate with an electrically-conductive layer separated into distinct sheets, an electrically-insulating layer, and thermally-conductive elements like heat sinks and plates is used to isolate heat-generating devices, preventing thermal coupling and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrically-driven devices are packed in close proximity on a substrate, then device density and functionality are improved, but thermal coupling occurs causing heat transfer between devices which deteriorates performance and lifespan
Solution Approach 1:
The common electrically-conductive layer is segmented into multiple separate electrically-conductive sheets, with each sheet corresponding to a specific heat-generating device. This segmentation prevents thermal coupling between devices by eliminating the continuous conductive path that previously allowed heat transfer, while still maintaining electrical connectivity for each individual device.
2Device complexity
If a common electrically-conductive layer is used for multiple devices, then electrical connectivity is simplified, but thermal isolation between devices is lost
Solution Approach 1:
The electrically-conductive layer is divided into multiple discrete sheets rather than using a single continuous layer. Each sheet serves a specific device, providing both electrical connectivity for that device and thermal isolation from other devices. This segmentation resolves the contradiction by simultaneously achieving simplified individual device connectivity and thermal isolation.
Solution Approach 2:
Each electrically-conductive sheet is locally positioned beneath its corresponding heat-generating device, providing electrical connectivity exactly where needed while preventing thermal coupling with adjacent devices. The local placement of conductive material ensures that electrical function is maintained without creating unwanted thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates thermal grounds among multiple heat-generating devices, preventing heat transfer and improving the performance and lifespan of affected devices by ensuring efficient heat dissipation.
Implementation Method 1
The electrically-conductive layer may be configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices
Implementation Method 2
a heat sink corresponding to a first one of the heat-generating devices to conduct heat away from the first one of the heat-generating devices
Data Source
AI summary
Embodiments of a mechanism of thermal isolation for multiple heat-generating devices on a substrate are described. In one aspect, a substrate is configured for a plurality of heat-generating devices to be disposed thereon. The substrate comprises an electrically-conductive layer that is electrically coupled to the heat-generating devices when the heat-generating devices are disposed on the substrate. The electrically-conductive layer is configured to thermally isolate the heat-generating devices such that there is no thermal coupling through the electrically-conductive layer amongst the heat-generating devices.