Thermal Joint Assembly Using Phase-Change TIM for Low Resistance

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Solution Overview

Problem

Conventional polymeric thermal interface materials used in electronic devices have short pot lives, require special storage and dispensing, and are not efficient in maintaining thermal conductivity, leading to increased thermal resistance and potential overheating.

Innovation Solution

Development of a thermoplastic phase change material with a softening temperature within or above the normal operating range of electronic components, which softens during adhesive curing and solidifies to form a low thermal resistance joint, eliminating the need for silicone and reducing assembly steps, storage requirements, and the use of special dispensing equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional polymeric thermal interface materials are used, then thermal transfer efficiency is improved, but the materials have short pot lives and require special storage and dispensing equipment

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidstorage and dispensing requirements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the material parameters by using a thermoplastic phase change material with a softening temperature within or above the normal operating range of electronic components, transforming it from a conventional polymeric material that requires special storage to a material that can be stored at room temperature and applied without special dispensing equipment

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes phase transition of the thermoplastic material, which softens during adhesive curing and solidifies to form a low thermal resistance joint, eliminating the need for silicone and reducing assembly steps while maintaining high thermal conductivity

Inventive Principle:

Principle #36Phase transitions

2Reliability

If conventional polymeric thermal interface materials are used, then thermal transfer efficiency is improved, but thermal resistance increases over time leading to overheating

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidthermal resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The thermoplastic phase change material softens during adhesive curing and solidifies to form a low thermal resistance joint, preventing overheating and delamination issues while maintaining high thermal conductivity

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent uses a composite material system combining thermoplastic phase change material with adhesive, creating a joint that maintains low thermal resistance over time while providing structural bonding

Inventive Principle:

Principle #40Composite materials

3Reliability

If conventional polymeric thermal interface materials are used, then thermal transfer efficiency is improved, but the assembly process becomes more complex with additional steps

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidassembly process complexity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges the thermal interface material function with the adhesive bonding process, where the thermoplastic phase change material is positioned between the heat spreader and heat source prior to curing the adhesive, eliminating separate application steps and reducing assembly complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermoplastic phase change material is positioned in advance between the heat spreader and heat source before adhesive curing, allowing the material to softening and solidify during the curing process itself, thereby eliminating subsequent assembly steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermoplastic phase change material provides high thermal conductivity, extended shelf life, and maintains low thermal resistance, preventing overheating and delamination issues, while simplifying the assembly process and eliminating the need for special storage and dispensing equipment.

Implementation Method 1

a thermoplastic phase change material with a softening temperature within or above the normal operating range of electronic components, which softens during adhesive curing and solidifies to form a low thermal resistance joint

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

The thermoplastic phase change material provides high thermal conductivity, extended shelf life, and maintains low thermal resistance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11776868B2Methods for establishing thermal joints between heat spreaders or lids and heat sources

Publication Date: 2023.10.03 LAIRD TECHNOLOGIES INC

AI summary

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.