Thermal Conductive Laminate Composition for Low Hardness Heat Transfer
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Solution Overview
Problem
Existing thermally conductive sheets face a trade-off between thermal conductivity and flexibility due to the blending ratios of fillers and plasticizers, leading to increased contact pressure on electronic components and reduced productivity and workability.
Innovation Solution
A laminate structure with specific blending ratios of thermally conductive fillers and dispersants in acrylic binders, along with controlled hardness and adhesiveness, to achieve high thermal conductivity and low hardness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the blending ratio of thermally conductive filler is increased, then thermal conductivity is improved, but hardness increases and flexibility decreases
Solution Approach 1:
The patent changes the chemical composition parameters of the binder system by specifying particular acrylic polymer types (polymerization degrees, glass transition temperatures, hydroxyl values) and their blending ratios to achieve the desired balance between thermal conductivity and hardness while maintaining flexibility
Solution Approach 2:
The patent creates a composite material system combining multiple acrylic polymers with specific properties (different polymerization degrees and glass transition temperatures) to achieve a binder that maintains flexibility while supporting high filler loading for thermal conductivity
2Strength
If the blending ratio of plasticizer is increased, then hardness is decreased, but adhesiveness increases and productivity decreases
Solution Approach 1:
The patent removes plasticizers from the composition entirely, replacing their softening function with a carefully designed acrylic polymer system that provides the necessary flexibility and processability without the adverse effects of plasticizers on adhesiveness and productivity
Solution Approach 2:
The patent changes the approach to controlling hardness by adjusting polymer molecular weight, polymerization degree, and glass transition temperature rather than adding plasticizers, thereby avoiding the trade-off between hardness reduction and increased adhesiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate structure maintains high thermal conductivity while suppressing hardness and adhesiveness, preventing deformation and improving workability and productivity.
Implementation Method 1
The dispersant contains at least one of a linear polyester having a weight-average molecular weight from 1000 to 2500 and having phosphoric acid at a terminal and a polyester-polyether copolymer having a weight-average molecular weight from 1000 to 2500 and having phosphoric acid at a terminal
Implementation Method 2
The first layer is formed of a first thermally conductive composition containing at least a first acrylic binder, a first thermally conductive filler, and a dispersant
Data Source
Figure 1A
Figure 1B
AI summary
Provided is a thermally conductive member having both high thermal conductivity and low hardness. A thermally conductive member is a laminate provided with a plurality of layers including a first layer and a second layer stacked in contact with each other. The first layer is formed of a first thermally conductive composition containing at least a first acrylic binder, a first thermally conductive filler, and a dispersant. The dispersant contains at least one of a linear polyester having a weight-average molecular weight from 1000 to 2500 and having phosphoric acid at a terminal and a polyester-polyether copolymer having a weight-average molecular weight from 1000 to 2500 and having phosphoric acid at a terminal.