Thermal Conductive Layer Drying Control for Filler Spacing
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Solution Overview
Problem
Conventional methods for forming thermal conductive layers in semiconductor devices often fail to properly exhibit thermal conductivity and electrical insulation due to improper spacing between fillers and rapid drying processes, leading to inadequate heat dissipation and potential circuit malfunctions.
Innovation Solution
A manufacturing method involving a composition with a resin, filler, and solvent, where the composition is applied using a spin coating method with specific solvent reduction techniques, including a discharge step and solvent amount reduction treatments like decompression or heating, to achieve a thermal diffusivity of 3.0×10−7 m2s−1 or more, ensuring proper thermal conductivity and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wet process such as spin coating is used to apply the composition, then the composition can be applied as a thin film, but the spacing between fillers becomes improper and thermal conductivity is insufficient
Solution Approach 1:
The patent changes the concentration parameter of the composition from conventional high solid content (80-90% or more) to a specific low solid content range (5-60%). This parameter change fundamentally alters the drying behavior and filler spacing, enabling proper thermal conductivity while maintaining ease of manufacture through spin coating.
Solution Approach 2:
The patent introduces a dynamic, multi-stage drying process that transitions from rapid initial drying to controlled slow drying. This dynamic approach allows the filler spacing to evolve properly during the drying process, achieving both ease of manufacture and reliable thermal conductivity.
2Reliability
If the solid content concentration is high (80% or more), then the thermal conductive layer has good thermal conductivity, but the composition cannot be properly applied and filler spacing is improper
Solution Approach 1:
The patent fundamentally changes the solid content concentration parameter from the conventional high range (80-90% or more) to a specific low range (5-60%). This parameter inversion resolves the contradiction by enabling proper application while achieving thermal conductivity through the optimized drying process and filler arrangement at lower concentrations.
Solution Approach 2:
The patent creates a composite composition system where the resin, filler, and solvent work together in a specific ratio (5-60% solid content). This composite approach allows the composition to be properly applied while the controlled drying process ensures optimal filler spacing for thermal conductivity.
3Productivity
If rapid drying is used to form the thermal conductive layer, then productivity is improved, but filler spacing becomes improper and thermal conductivity is insufficient
Solution Approach 1:
The patent implements a periodic, multi-stage drying process with distinct phases: an initial rapid drying stage followed by a controlled slow drying stage. This periodic action allows productivity to be maintained through the fast initial stage while ensuring proper filler spacing and thermal conductivity through the subsequent controlled stage.
Solution Approach 2:
The patent introduces dynamic control of the drying process, transitioning from rapid to slow drying at specific stages. This dynamic approach optimizes both productivity and thermal conductivity by matching the drying rate to the filler arrangement requirements at each stage of the process.
4Device complexity
If conventional compositions are used, then the manufacturing process is simple, but the thermal conductive layer does not exhibit proper thermal conductivity and electrical insulation
Solution Approach 1:
The patent changes key parameters of the composition (solid content to 5-60%, specific resin-to-filler ratios) and the drying process (multi-stage with controlled rates). These parameter changes maintain manufacturing simplicity while achieving proper thermal conductivity and electrical insulation that conventional compositions cannot provide.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively enhances thermal conductivity and electrical insulation of the thermal conductive layer, enabling efficient heat dissipation and preventing circuit malfunctions, thus addressing the limitations of existing technologies.
Implementation Method 1
a method in which all components of the composition for forming a thermal conductive layer are dissolved in a solvent, the dissolved mixture is applied onto a support by a wet process such as a spin coating method
Implementation Method 2
the applied material is dried
Implementation Method 3
solvent amount reduction treatments like decompression or heating
Implementation Method 4
a thermal conductive layer having a thermal diffusivity of 3.0×10−7 m2s−1 or more is manufactured on a support
Data Source
AI summary
There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10−7 m2s−1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.