Thermal Lid Coupling in Rotating Shaft Electronics
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Solution Overview
Problem
Turbomachines face challenges in dissipating thermal energy from electronic components mounted on rotatable shafts, which are sealed and subject to thermal fatigue due to increasing data requirements and operational heat generation.
Innovation Solution
A system and method involving an annular carrier shaft with a transmitter assembly that includes a thermally conductive circuit board and a lid, where the lid is thermally coupled to the carrier shaft via centrifugal forces, allowing for conductive heat transfer from electronic components to the carrier shaft, effectively dissipating thermal energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are sealed within the carrier shaft to protect them, then reliability is improved, but thermal energy dissipation deteriorates
Solution Approach 1:
A thermally conductive lid is introduced as an intermediary component between the electronic components and the carrier shaft. The lid serves as a thermal mediator that conducts heat away from the sealed electronic components to the rotating carrier shaft, enabling heat dissipation while maintaining the sealed protective environment of the electronics.
Solution Approach 2:
The lid is designed with differentiated local properties: a thermally conductive outer surface for heat transfer to the carrier shaft, and a sealed inner surface that protects the electronic components. This local quality differentiation allows simultaneous achievement of protection and thermal management.
2Measurement precision
If data requirements increase to enhance operational monitoring, then measurement precision is improved, but thermal energy generation worsens
Solution Approach 1:
The thermal energy generated by the electronic components as a byproduct of high-performance data processing is converted into a useful function. The same components that generate heat due to increased computational demands also serve as heat sources that drive the thermal conduction mechanism through the lid to the carrier shaft, transforming a harmful effect into a functional aspect of the design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates thermal energy from electronic components, reducing the risk of thermal fatigue and enhancing the operational reliability of turbomachines by utilizing the carrier shaft's thermal conductivity to radiate heat away from the components.
Implementation Method 1
A strip of thermally conductive material is disposed along a top portion of the circuit board. A contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board.
Implementation Method 2
At least a portion of a top surface of the lid is in thermal communication with the inner surface of the carrier shaft during rotation thereof
Implementation Method 3
allowing for conductive heat transfer from electronic components to the carrier shaft, effectively dissipating thermal energy
Data Source
AI summary
A system for dissipating thermal energy from electronic components disposed within a rotatable shaft includes an annular carrier shaft having one end formed to couple to an end of a rotor shaft. The system also includes a transmitter assembly. The transmitter includes an outer casing, a daughter board and a circuit board electronically coupled to the daughter board within an inner pocket of the transmitter housing. The circuit board comprises a strip of thermally conductive material. The transmitter assembly further includes a lid that at least partially seals the inner pocket. A contact surface of the lid is in thermal communication with the thermally conductive material of the circuit board and at least a portion of a top surface of the lid is thermally coupled to an inner surface of the carrier shaft during rotation thereof. A method for dissipating thermal energy away from the circuit board is also provided.


