Thermal Locking Interface Using a Compressible Porous Fluid Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electrical assembly locking devices face challenges in controlling thermal resistance due to surface roughness and contact pressure, especially with the miniaturization of electronic components leading to increased heat generation, necessitating improved thermal conductance solutions.
Innovation Solution
A locking device with a fluid-permeable member, such as a nano-structured metal sponge, is used between the electrical assembly board and heat sink, where an actuator compresses the fluid-permeable member to form fluid contact interfaces, reducing thermal resistance by almost ten times compared to metal bulk contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal bulk contact is used for thermal management, then the structure is simple and easy to manufacture, but the thermal resistance is high due to surface roughness and contact pressure control difficulties
Solution Approach 1:
The patent employs a fluid-permeable member with porous structure that can be compressed to expel fluid and create intimate contact with mating surfaces. The porous structure allows fluid penetration and saturation, enabling the material to adapt to surface irregularities and achieve low thermal resistance contact interfaces without requiring precise control of surface roughness or contact pressure
Solution Approach 2:
The patent changes the physical state and properties of the contact interface by using a compressible fluid-permeable member saturated with fluid. By applying compression force, the material parameters change - the fluid is expelled and the porous structure collapses, transforming from a highly porous state to a dense contact state, thereby achieving low thermal resistance
2Productivity
If electronic components are miniaturized to increase power requirements and heat generation, then the packaging density increases, but the thermal management becomes more challenging due to increased heat generation per assembly
Solution Approach 1:
The fluid-permeable member with porous structure provides superior thermal contact by adapting to microscopic surface variations, ensuring efficient heat transfer paths even in miniaturized assemblies where contact area is limited. This enables effective thermal management in high-density packaging scenarios
Solution Approach 2:
The patent uses a composite structure combining a fluid-permeable porous material with saturating fluid to create a thermal interface material that outperforms conventional solid metal contacts. This composite approach enables effective heat dissipation in miniaturized electronic assemblies with high power density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid contact interfaces provide enhanced thermal conductance, effectively managing heat dissipation and maintaining temperature specifications within electrical assemblies by reducing thermal resistance.
Implementation Method 1
The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface
Implementation Method 2
The fluid contact interfaces provide enhanced thermal conductance, effectively managing heat dissipation and maintaining temperature specifications within electrical assemblies by reducing thermal resistance
Data Source
AI summary
A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.