Thermal Management in 2.5D Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
2.5 D semiconductor packaging faces challenges in thermal management due to space and airflow limitations, making it difficult to control the operating temperature of semiconductor dies mounted beneath the interposer, particularly in compact cavities that cannot accommodate large heat sinks or sufficient airflow.
Innovation Solution
The implementation of heat pipes thermally coupling lower semiconductor dies to a heat sink or thermal vias extending through the substrate, allowing for efficient heat dissipation into free-flowing air or a heat sink, and the use of intermediate heat sinks for enhanced thermal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor dies are mounted in a compact 2.5D packaging configuration beneath the interposer, then integration density and miniaturization are improved, but thermal management capability deteriorates due to space and airflow limitations
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat transfer by routing heat pipes vertically through the substrate and positioning heat sinks above the interposer. This vertical dimension allows heat to escape from the lower semiconductor die without requiring lateral space, resolving the contradiction between compact packaging and thermal management.
Solution Approach 2:
The patent introduces heat pipes as intermediary components that thermally couple the lower semiconductor die to the heat sink positioned above the interposer. These heat pipes act as mediators to transfer heat through the compact packaging structure, enabling effective thermal management despite the constrained space beneath the interposer.
2Temperature
If heat sinks are placed beneath the substrate to cool lower semiconductor dies, then thermal management is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent combines multiple thermal management functions into a single integrated structure by positioning the heat sink above the interposer and using heat pipes to simultaneously cool both the upper and lower semiconductor dies. This merging approach improves heat dissipation efficiency while reducing overall device complexity compared to separate cooling systems.
Solution Approach 2:
The heat sink positioned above the interposer serves multiple functions: it cools the upper semiconductor die directly and, through the heat pipe thermal pathway, also cools the lower semiconductor die. This multi-functionality allows effective thermal management of both dies with a single heat sink, reducing the need for additional cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages the operating temperature of lower semiconductor dies by facilitating heat dissipation from the compact 2.5 D packaging configuration, ensuring the dies operate within an acceptable range, even for high-power devices, by utilizing thermally conductive materials and strategic heat pipe routing.
Implementation Method 1
a heat pipe thermally coupling the lower semiconductor die to the heat sink
Implementation Method 2
one or more thermal vias extending through the substrate
Data Source
AI summary
Lower semiconductor dies in 2.5 D semiconductor packaging configurations can be cooled by thermally coupling the lower semiconductor dies to a heat sink positioned above the interposer, to an upper semiconductor die, to a heat sink affixed beneath a substrate, or to free-flowing air circulating above the interposer or beneath the substrate. The thermal coupling can be achieved using heat pipes, thermal vias, or other conductive passage ways.