Thermal Management Chip With Built-In Interface Host

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Solution Overview

Problem

Existing thermal management systems for air cooling, such as those in servers and data centers, face challenges with high cost, low accuracy, and complex assembly, particularly in controlling fan speed for efficient heat dissipation and extending fan lifespan.

Innovation Solution

A thermal management chip with a built-in interface host, incorporating a controllable current source sequence, temperature sensing devices, an ADC module, register bank, and a master-slave mode select switch, allows for local and remote temperature sensing, fan speed control, and adaptive PWM output to manage thermal conditions effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fan continues to rotate at full speed for air cooling, then heat dissipation efficiency is improved, but fan lifespan deteriorates and energy consumption increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidfan lifespan
Core Design Contradiction:
TemperatureVSDuration of action of moving object

Solution Approach 1:

The patent implements dynamic fan speed control based on real-time temperature monitoring. The system adjusts fan rotation speed according to actual thermal conditions rather than maintaining constant full speed, thereby extending fan lifespan while maintaining adequate heat dissipation. The control logic modifies operational parameters dynamically based on sensor feedback.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates temperature sensors that continuously monitor thermal conditions and feed this information back to the control logic. This feedback mechanism enables the system to adjust fan speed appropriately - increasing it only when temperature thresholds are exceeded - thus avoiding unnecessary full-speed operation that would reduce fan lifespan and increase energy consumption.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If multiple components are used in thermal management system, then temperature monitoring capability is improved, but system complexity and cost increase

Engineering Contradiction:
Improvetemperature monitoring capabilityVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent integrates temperature sensing, ADC conversion, control logic, and fan driver functions into a single unified thermal management chip. This consolidation maintains accurate temperature monitoring capabilities while significantly reducing system complexity by eliminating the need for multiple separate components and their interconnections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The thermal management chip performs multiple functions including temperature sensing through integrated sensors, analog-to-digital conversion, control logic execution, and fan driver output. This multi-functional design achieves comprehensive temperature monitoring and control without requiring separate dedicated components for each function, thereby reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Use of energy by moving object

If fan speed is controlled to save energy, then energy consumption is reduced, but heat dissipation efficiency may deteriorate

Engineering Contradiction:
Improveenergy consumptionVSAvoidheat dissipation efficiency
Core Design Contradiction:
Use of energy by moving objectVSTemperature

Solution Approach 1:

The system continuously monitors temperature and adjusts fan speed in response to actual thermal conditions. When temperatures are within acceptable ranges, the fan operates at lower speeds to conserve energy. When temperature thresholds are exceeded, the fan speed increases automatically to maintain adequate heat dissipation, thus balancing energy consumption with thermal management effectiveness.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The fan operates dynamically with variable speed rather than at fixed full speed. The control system adjusts rotation speed in real-time based on thermal demands, enabling energy savings during low-heat conditions while ensuring adequate cooling performance when needed, thus resolving the trade-off between energy consumption and heat dissipation efficiency.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient thermal management by reducing energy consumption and extending fan lifespan through precise temperature monitoring and fan speed control, while simplifying system complexity and expanding temperature information sources.

Implementation Method 1

a temperature sensing device category decision module, an analog-to-digital converter (ADC) module

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

an analog-to-digital converter (ADC) module, is configured to connect an external temperature sensing device and acquire temperature information

Methodology Applied
Scientific EffectAnalog-to-Digital Conversion:

Implementation Method 3

a pulse-width modulation (PWM) port, a tachometer (TACH) port

Methodology Applied
Scientific EffectPulse-Width Modulation:

Data Source

PatentUS20240370068A1Thermal Management Chip And System With Built-In Interface Host, And Management Method
Publication Date: 2024.11.07 SHANGHAI SHENXILING MICROELECTRONICS TECH CO LTD
  • US20240370068A1 patent drawing
  • US20240370068A1 patent drawing
  • US20240370068A1 patent drawing

AI summary

The present disclosure provides a thermal management chip and system with a built-in interface host, and a management method. The thermal management chip includes a controllable current source sequence, a temperature sensing device category decision module, an analog-to-digital converter (ADC) module, a register bank & interface & control logic module, a non-volatile memory (NVM), a clock generator, and a local temperature sensing transistor. The thermal management chip further includes an Aip port, an Ain port, a pulse-width modulation (PWM) port, a tachometer (TACH) port, a master-slave mode select port, a serial data (SDA) port, a serial clock (SCL) port, and a status indication port.