Thermal Management for Wireless Data Modules

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Solution Overview

Problem

Data modules without active cooling mechanisms face challenges in managing thermal conditions due to their small form factor, leading to potential overheating and reduced uplink data rates, as existing solutions like limiting transmission power compromise performance.

Innovation Solution

A closed-loop feedback mechanism using temperature sensors and a thermal management unit (TMU) to monitor thermal characteristics and adjust operating characteristics of components like modems, power amplifiers, and RF circuitry, reducing power consumption and heat generation by adjusting data rates, clock frequencies, and voltage settings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If active cooling mechanisms (heat sinks, fans) are added to data modules, then thermal management capability is improved, but device complexity, cost, and space requirements worsen

Engineering Contradiction:
Improvethermal management capabilityVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The data module monitors its own temperature through temperature sensors and automatically adjusts its operating parameters (transmit power, data rate, clock frequency) through a thermal management unit, eliminating the need for external active cooling mechanisms while maintaining effective thermal control

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system dynamically changes operational parameters such as transmit power level, data transmission rate, and clock frequency based on real-time temperature conditions, allowing the device to self-regulate heat generation without adding physical cooling components

Inventive Principle:
Principle #35Parameter changes

2Temperature

If transmit power is limited to reduce heat generation, then thermal conditions are improved, but uplink data rates worsen

Engineering Contradiction:
Improvethermal conditionsVSAvoiduplink data rates
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The thermal management unit dynamically adjusts operational parameters based on real-time temperature monitoring, allowing the system to operate at high power levels when cool and reduce power only when necessary, rather than permanently limiting performance

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system uses temperature sensors to continuously monitor thermal conditions and feeds this information back to the thermal management unit, which then adjusts transmit power and data rates accordingly, creating a closed-loop control system that balances thermal management with performance maintenance

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively maintains thermal conditions within acceptable levels without active cooling, preventing overheating and reducing power consumption while minimizing performance degradation, allowing for graceful performance reduction during thermal events.

Implementation Method 1

determining, based on signals from temperature sensors, thermal characteristics of circuit components

Methodology Applied
Scientific EffectTemperature sensing:

Data Source

PatentEP2304518B1Thermal management for data modules
Publication Date: 2018.05.09 QUALCOMM INC
  • EP2304518B1 patent drawingFigure 1
  • EP2304518B1 patent drawingFigure 2
  • EP2304518B1 patent drawingFigure 3

AI summary

A data module operable in a wireless communication system is provided. The data module comprises a plurality of circuit components, one or more temperature sensors, and a thermal management unit. The temperature sensors are configured to determine the temperature of a corresponding circuit component. The thermal management unit is configured to determine one or more thermal characteristics of the data module based on the temperature determinations, and to generate one or more power control point signals indicating whether to adjust corresponding operating characteristics of a target component based on the determined thermal characteristics.