Thermal Management Devices and Methods
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Solution Overview
Problem
Existing temperature management devices for spaces like data centers and freezers are often costly, require permanent installation, and consume significant energy, limiting their widespread adoption and efficiency.
Innovation Solution
A modular, cost-effective thermal management device in the form of a plate or panel with a high surface area to volume ratio, filled with phase change materials, and equipped with a fill spout and optional fan for efficient thermal energy management, which can be easily installed and configured to maintain desired temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active temperature management systems are used, then temperature control capability is improved, but energy consumption increases
Solution Approach 1:
The patent applies preliminary action by pre-cooling or pre-heating spaces using phase change materials before peak thermal loads occur. The PCM absorbs or releases latent heat during phase transitions to maintain desired temperatures without requiring continuous active cooling, thereby reducing energy consumption while maintaining temperature control capability.
Solution Approach 2:
The patent directly applies phase transitions by utilizing phase change materials that absorb or release large amounts of latent heat during phase transitions (e.g., solid-liquid transitions). This passive thermal management approach replaces energy-intensive active cooling systems, maintaining temperature control while significantly reducing energy consumption.
2Temperature
If permanent installation systems are used, then temperature management effectiveness is improved, but installation cost and complexity increase
Solution Approach 1:
The patent applies segmentation by dividing the thermal management system into modular phase change material units that can be independently installed and positioned. These segmented units can be placed in strategic locations within a space to achieve effective temperature management without requiring permanent, complex installation infrastructure, thereby reducing installation cost and complexity.
Solution Approach 2:
The patent applies self-service by designing phase change material units that are self-regulating and require minimal installation infrastructure. The PCMs automatically absorb or release heat based on temperature conditions without requiring complex control systems or permanent installation, enabling easy deployment and reducing installation cost and complexity while maintaining effectiveness.
3Temperature
If existing thermal management devices are used, then temperature control is achieved, but recouping initial cost is delayed
Solution Approach 1:
The patent applies phase transitions by utilizing phase change materials that provide high-density latent heat storage. This enables compact thermal management systems with reduced material quantities and smaller installation footprints, lowering initial costs and enabling faster recouping of investment while maintaining effective temperature control.
Solution Approach 2:
The patent applies parameter changes by optimizing the thermal properties and phase transition temperatures of PCMs to match specific application requirements. This customization enables more efficient thermal management with reduced material quantities and faster payback periods, addressing the time to recoup initial cost concern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides efficient thermal management with reduced energy consumption and installation costs, enabling effective temperature control in various spaces while being easy to implement and adaptable.
Implementation Method 1
The thermal management material, in some embodiments, has a phase transition temperature between −50° C. and 150° C.
Implementation Method 2
The thermal management plate can further comprise a thermal management material disposed within the interior volume
Implementation Method 3
The one or more protrusions can form a gap between the back side and an adjacent surface that is operable to ventilate or otherwise permit air flow
Data Source
AI summary
In one aspect, thermal management devices are described herein. In some embodiments, the thermal management device is a thermal management plate comprising an exterior surface defining an interior volume, and a thermal management material disposed within the interior volume. Additionally, the plate includes a fill spout. The fill spout (when in an open configuration) provides fluid communication between the interior volume and the external environment of the plate. The exterior surface of the plate includes a front side, a back side, and at least four corners. The fill spout is disposed at one of the corners of the exterior surface. The plate can have a generally polyhedral shape, and the specific shape of the plate is not particularly limited.