Thermal Management for Electrical Components on Printed Boards
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Solution Overview
Problem
Conventional thermal management techniques for electrical components on printed boards often fail to effectively manage heat, leading to increased operating temperatures and reduced component density due to reliance on electrical pathways for heat conduction, which can degrade electrical performance.
Innovation Solution
The integration of thermally conductive attach pads, thermal vias, and heat sinks, along with thermal bridges and interface materials, creates dedicated pathways for heat transfer away from electrical components, isolating thermal management from electrical pathways to prevent performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electrical pathways are used for heat conduction, then thermal management is achieved, but electrical performance degrades
Solution Approach 1:
The patent divides the thermal management function from the electrical connection function by introducing separate thermal attach pads and thermal pathways. The electrical component has dedicated electrical attach pads for electrical connection and separate thermal attach pads for heat dissipation, with thermal vias providing independent thermal pathways that do not interfere with electrical signals.
Solution Approach 2:
The patent extracts the thermal management function from the electrical pathways by creating dedicated thermal pathways through thermal vias and thermal attach pads. This separation allows heat to be conducted away through independent thermal routes, preventing the degradation of electrical performance that occurs when electrical pathways are used for heat conduction.
2Temperature
If thermal management features are added, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures where possible. For example, the substrate integrates both electrical attach pads and thermal attach pads in a unified design, and thermal vias are incorporated directly into the substrate structure during manufacturing, reducing the need for separate assembly steps and minimizing overall complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical connections through electrical attach pads and traces, thermal management through thermal attach pads and thermal vias, and structural integration for mounting electrical components. This multi-functionality reduces the need for separate dedicated structures for each function.
3Productivity
If component density is increased, then productivity improves, but thermal management becomes more difficult
Solution Approach 1:
The patent utilizes the vertical dimension by implementing thermal vias that extend through the substrate thickness, providing three-dimensional thermal pathways. This allows heat to be conducted away from densely packed components through vertical thermal routes, effectively managing heat dissipation in high-density configurations where horizontal thermal pathways would be insufficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach efficiently manages heat without impacting electrical performance, allowing for increased component density and improved operating temperatures by providing a low-impedance thermal path to heat sinks.
Implementation Method 1
a thermal interface material that is thermally connected to the electrical component and to the thermally conductive attach pad
Implementation Method 2
a thermally conductive attach pad of the printed board in thermal communication with the heat sink
Implementation Method 3
at least one thermally conductive thermal attach pad that is thermally connected to a thermal heat sink
Data Source
AI summary
Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.