Thermal Management Component Design Using Modular 3D Elements
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Solution Overview
Problem
Conventional methods for designing thermal management components are computationally inefficient and require significant experimentation to incorporate strength and loading requirements, making them unsuitable for multifunctional applications.
Innovation Solution
A computer-implemented method for generating a three-dimensional structure for thermal management components by selecting three-dimensional elements, determining the necessary surface area for heat dissipation, and intercoupling the elements to achieve the desired surface area, while also considering structural requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional iterative sizing methods are used to design thermal management components, then thermal requirements can be optimized, but the design process requires substantial time and computational resources
Solution Approach 1:
The patent applies preliminary action by pre-defining a library of validated three-dimensional elements with known thermal and structural properties. Instead of iteratively designing and validating each component from scratch, the system selects and combines pre-validated elements, eliminating repeated computational experimentation and significantly reducing design time while maintaining thermal performance optimization.
2Ease of manufacture
If conventional plate and fin structures are used, then manufacturing is straightforward, but structural strength and loading requirements cannot be met
Solution Approach 1:
The patent applies composite materials principle by combining multiple three-dimensional elements with different structural characteristics into hybrid configurations. These composite structures integrate the manufacturing simplicity of conventional approaches with enhanced structural strength, allowing the thermal management component to simultaneously meet both ease of manufacture and structural loading requirements through synergistic element combinations.
3Device complexity
If conventional design methods are used, then simple geometric structures can be implemented, but multifunctional applications with strength and loading requirements cannot be satisfied
Solution Approach 1:
The patent applies segmentation by dividing the thermal management component into modular three-dimensional elements that can be independently selected and combined. This segmentation allows the system to maintain geometric simplicity at the element level while achieving multifunctional capability through strategic assembly of different element types, enabling adaptation to various thermal and structural requirements without increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the design of thermal management components that are computationally efficient, meet thermal and structural requirements, and can be optimized for specific applications, thereby improving design efficiency and performance.
Implementation Method 1
determining a surface area necessary to dissipate heat from a first fluid according to a desired temperature difference and a desired heat transfer coefficient
Implementation Method 2
determining a surface area necessary to dissipate heat from a first fluid according to a desired temperature difference and a desired heat transfer coefficient
Data Source
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AI summary
Disclosed herein is a computer-implemented method of generating a three-dimensional structure for a thermal management component. The computer-implemented method of generating a three-dimensional structure for a thermal management component comprises selecting, by a processor, at least one three-dimensional element from a plurality of three-dimensional elements. The computer-implemented method of generating a three-dimensional structure for a thermal management component also comprises determining, by the processor, a surface area necessary to dissipate heat from a first fluid according to a desired temperature difference and a desired heat transfer coefficient. The computer-implemented method of generating a three-dimensional structure for a thermal management component further comprises generating, by the processor, the three-dimensional structure for the thermal management component by intercoupling a quantity of the selected three-dimensional elements whose combined surface area equals the determined surface area.