Thermal management module
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Solution Overview
Problem
The existing thermal management modules with die-cast flow channel plates have complex structures, high costs, and heavy weights due to their multifunctional roles in both support and communication.
Innovation Solution
The thermal management module is designed with a support component and a connecting component, where the support component primarily handles the support function, and the connecting component manages the communication function, thereby separating these functions and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a die-cast flow channel plate is used to integrate support and communication functions, then the structural integrity and functionality are improved, but the manufacturing complexity, cost, and weight increase
Solution Approach 1:
The patent divides the integrated flow channel plate into separate components: a support component (bracket) and connecting components (pipes/tubes). The support component provides structural support and defines transfer holes, while the connecting components provide fluid communication channels. This segmentation allows each component to be manufactured independently using simpler processes such as extrusion, stamping, or bending, rather than complex die-casting, thereby reducing manufacturing complexity and cost while maintaining structural integrity through functional specialization
2Reliability
If a die-cast flow channel plate is used to integrate support and communication functions, then the structural integrity and functionality are improved, but the weight increases
Solution Approach 1:
By segmenting the integrated flow channel plate into separate support and connecting components, the patent enables optimization of each component's material usage and structure. The support component can be designed with minimal material for structural support, while connecting components can use thinner-walled pipes or tubes for fluid transport, reducing overall weight compared to a heavy die-cast integrated plate
Solution Approach 2:
The patent uses hollow connecting components (pipes, tubes, conduits) to provide fluid communication channels. These hollow structures provide the necessary fluid pathways with minimal material, replacing the solid or thick-walled channels that would be required in a die-cast integrated plate, thereby significantly reducing weight while maintaining communication functionality
3Adaptability or versatility
If a die-cast flow channel plate is used, then the support and communication functions are integrated, but the manufacturing cost increases
Solution Approach 1:
The patent segments the integrated flow channel plate into separately manufacturable support and connecting components. The support component can be manufactured by extrusion or stamping, and connecting components can be made by pipe bending, tube forming, or extrusion. These processes are generally less costly than die-casting, especially for high-volume production, thereby reducing manufacturing cost while maintaining functional integration through assembly
4Adaptability or versatility
If a die-cast flow channel plate is used, then the support and communication functions are integrated, but the manufacturing process becomes complicated
Solution Approach 1:
By dividing the integrated flow channel plate into separate support and connecting components, the patent enables each component to be manufactured using simpler, more conventional processes. The support component can be made by extrusion or stamping, and connecting components by pipe forming or bending. This eliminates the need for complex die-casting molds and multi-step integration processes, simplifying the overall manufacturing process while maintaining functional integration through modular assembly
Data Source
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AI summary
A thermal management module includes a thermal management component, a support component and a connecting component. The support component includes a first surface and a second surface. The thermal management component is located at least partially on a side of the first surface. The connecting component is located at least partially on a side of the second surface. The thermal management component is connected to the side of the first surface. The connecting component is connected to the side of the second surface. The support component has a transfer hole communicating with the thermal management component and the connecting component. The connecting component has a channel communicating with the transfer hole. The thermal management component includes at least two sub-components. The thermal management module has a flow channel communicating with at least two sub-components. The transfer hole and the channel are at least part of the flow channel.