Thermal Management Module for Electronic Component Testing
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Solution Overview
Problem
Conventional testing apparatuses for electronic components face inefficiencies in heat dissipation during high temperature tests, leading to overheating and wastage of liquid nitrogen during low temperature tests, as the existing systems struggle to maintain a specific test temperature efficiently.
Innovation Solution
The apparatus incorporates a depressing head with a cooling module, heating module, and heat dissipation module, featuring a finned heat sink and heat conduction member, along with a fan for enhanced airflow, allowing for efficient heat transfer and dissipation, and the use of thermal fluid mediums for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heater is interposed between the cold plate and the electronic component for heating, then the electronic component can be heated to high temperature, but the heat dissipation efficiency deteriorates and liquid nitrogen is wasted
Solution Approach 1:
The depressing head is divided into distinct functional modules: a cooling module with cold plate, a heating module with heater, and a heat dissipation module with heat sink and fan. These modules are arranged in specific spatial relationships to enable independent operation for heating or cooling, eliminating the need to maintain the heater interposed structure that blocks heat dissipation pathways.
Solution Approach 2:
The system dynamically switches between heating and cooling modes by controlling the heater and fan based on real-time temperature feedback. The depressing head can adapt its thermal management strategy, activating the heat dissipation module when cooling is needed and the heating module when heating is needed, rather than maintaining a fixed interposed structure.
2Temperature
If the heater is interposed between the cold plate and the electronic component, then heating function is provided, but the cooling effect deteriorates due to blocked heat dissipation path
Solution Approach 1:
The thermal management system is segmented into separate heating and cooling modules within the depressing head. The heat dissipation module with heat sink and fan is positioned to provide direct cooling pathways to the electronic component, independent of the heater's position, enabling efficient heat dissipation without being blocked by the heater structure.
Solution Approach 2:
The heat dissipation module acts as an intermediary cooling system between the electronic component and the environment. The fan serves as a mediator to force air flow through the heat sink, enhancing convective heat transfer and providing effective cooling without requiring direct contact between the cold plate and component.
3Temperature
If liquid nitrogen is filled into the cold plate for heat dissipation during high temperature test, then the electronic component can be cooled, but the heater blocks efficient heat dissipation and liquid nitrogen is wasted
Solution Approach 1:
The system dynamically selects between air-based heat dissipation (fan and heat sink) and liquid nitrogen-based cooling (cold plate) based on the thermal management needs. The fan and heat sink provide primary cooling during normal operation, reserving liquid nitrogen for extreme cooling requirements, thereby reducing overall liquid nitrogen consumption.
Solution Approach 2:
The heat dissipation module with fan and heat sink provides self-service cooling capability using ambient air, reducing dependence on liquid nitrogen. The system can maintain thermal balance through passive or active air cooling, only resorting to liquid nitrogen when necessary, making the system more self-sufficient and less consumptive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and efficient heating and cooling of electronic components, maintaining a constant test temperature, reducing energy waste, and extending the service life of components by effectively managing heat dissipation and nitrogen consumption.
Implementation Method 1
the cooling module comprises a first end face and a second end face, the heating module is abutted on the second end face of the cooling module
Implementation Method 2
a heating module for heating the electronic component, wherein the heating module is abutted on the second end face of the cooling module
Implementation Method 3
the heat dissipation module comprises a finned heat sink and a heat conduction member, wherein the finned heat sink is abutted on the first end face of the cooling module
Implementation Method 4
heat is dissipated from the finned heat sink to the atmosphere
Implementation Method 5
the heat conduction member is thermally coupled to the heating module and the finned heat sink
Implementation Method 6
an element or material that absorbs heat by phase change for heat transfer
Implementation Method 7
The fan is provided to enhance heat dissipation from the finned heat sink
Data Source
AI summary
An apparatus and a method provide a high temperature test and a low temperature test. The apparatus mainly includes a depressing head and a test base, wherein the depressing head includes a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module includes a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.